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MBM29DL640E90PBT
Spansion
|
Check for Price | No | No | Obsolete | 67.1089 Mbit | 16 | 8K,64K | 4MX16 | 3 V | 90 ns | FLASH | 8 | BOTTOM/TOP | YES | YES | YES | 1 | 16,126 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 58 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | SPANSION INC | BGA | PLASTIC, FBGA-63 | 63 | compliant | EAR99 | 8542.32.00.51 | |||
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MBM29DL640E90PBT
FUJITSU Semiconductor Limited
|
Check for Price | Transferred | 67.1089 Mbit | 16 | 4MX16 | 3 V | 90 ns | FLASH | 8 | 2 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | FUJITSU SEMICONDUCTOR AMERICA INC | BGA | PLASTIC, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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MBM29DL640E90PBT
FUJITSU Limited
|
Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 8K,64K | 4MX16 | 3 V | 90 ns | FLASH | CONFIGURABLE AS 8M X 8 | 8 | BOTTOM/TOP | YES | YES | YES | 1 | 16,126 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 58 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | FUJITSU LTD | BGA | PLASTIC, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 | |||
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MBM29DL640E90PBT-E1
Spansion
|
Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3 V | 90 ns | FLASH | 8 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B63 | Not Qualified | e1 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | SPANSION INC | BGA | PLASTIC, FBGA-63 | 63 | compliant | EAR99 | 8542.32.00.51 |