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MC0.0625W04021%1M21
SPC Multicomp
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Check for Price | Contact Manufacturer | 1.21 MΩ | 1 % | 62.5 mW | 0402 | SURFACE MOUNT | SMT | 100 ppm/°C | FIXED RESISTOR | METAL GLAZE/THICK FILM | 70 °C | YES | 50 V | e3 | 155 °C | -55 °C | Rectangular | 2 | RECTANGULAR PACKAGE | TIN OVER NICKEL | WRAPAROUND | 350 µm | 1 mm | 500 µm | SPC TECHNOLOGY/ MULTICOMP | CHIP | unknown | EAR99 | 8533.21.00.30 | |||
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MC0.0625W04021%1M21FR
SPC Multicomp
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Check for Price | Obsolete | 1.21 MΩ | 1 % | 62.5 mW | 0402 | SURFACE MOUNT | SMT | 100 ppm/°C | FIXED RESISTOR | METAL GLAZE/THICK FILM | 70 °C | YES | 50 V | e3 | 155 °C | -55 °C | Rectangular | 2 | RECTANGULAR PACKAGE | TR | TIN OVER NICKEL | WRAPAROUND | 350 µm | 1 mm | 500 µm | SPC TECHNOLOGY/ MULTICOMP | CHIP | unknown | EAR99 | 8533.21.00.30 | ||
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MC00625W040211M21
SPC Multicomp
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Check for Price | Contact Manufacturer | 1.21 MΩ | 1 % | 62.5 mW | 0402 | SURFACE MOUNT | SMT | 100 ppm/°C | FIXED RESISTOR | METAL GLAZE/THICK FILM | 70 °C | YES | 50 V | e3 | 155 °C | -55 °C | Chip | 2 | RECTANGULAR PACKAGE | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 350 µm | 1 mm | 500 µm | SPC TECHNOLOGY/ MULTICOMP | SMT, 0402 | unknown | EAR99 | 8533.21.00.30 |