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MPC5554MZP80
NXP Semiconductors
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$71.1700 | No | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | |||||
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MPC5554MZP80
Rochester Electronics LLC
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Check for Price | No | No | Active | 32 | 80 MHz | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | NO | NO | YES | YES | FLASH | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | ROCHESTER ELECTRONICS LLC | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | unknown | BGA | 416 | |||||||||||||
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MPC5554MZP80R2
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | BGA | 416 | ||||
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MPC5554MZP80R2
NXP Semiconductors
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Check for Price | No | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | HBGA, BGA416,26X26,40 | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||
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MPC5554MZP80
Freescale Semiconductor
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Check for Price | No | No | Transferred | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | BGA | 416 |