Findchips: Parametric Search Results for NAND01GW3B2BZA6

Parametric results for: NAND01GW3B2BZA6 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		NAND01GW3B2BZA6T Numonyx Memory Solutions
		NAND01GW3B2BZA6T Micron Technology Inc
		NAND01GW3B2BZA6E Numonyx Memory Solutions
		NAND01GW3B2BZA6 Micron Technology Inc
		NAND01GW3B2BZA6T STMicroelectronics
		NAND01GW3B2BZA6 Numonyx Memory Solutions
		NAND01GW3B2BZA6F Micron Technology Inc
		NAND01GW3B2BZA6E Micron Technology Inc
		NAND01GW3B2BZA6F Numonyx Memory Solutions
		NAND01GW3B2BZA6F STMicroelectronics

				Most Relevant						Technical																				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Command User Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

1.0737 Gbit

128MX8

3 V

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA, BGA63,10X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

1.0737 Gbit

128MX8

3 V

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0737 Gbit

128K

128MX8

3 V

20 ns

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0737 Gbit

128K

128MX8

3 V

20 ns

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

Micron

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA, BGA63,10X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

STMICROELECTRONICS

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

1 2 Next

Compare

NAND01GW3B2BZA6T

Numonyx Memory Solutions

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6T

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

128MX8

3 V

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6E

Numonyx Memory Solutions

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA, BGA63,10X12,32

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

128MX8

3 V

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6T

STMicroelectronics

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

NAND01GW3B2BZA6

Numonyx Memory Solutions

Check for Price

Transferred

1.0737 Gbit

128MX8

3 V

35 ns

FLASH

128000000

134.2177 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6F

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

128K

128MX8

3 V

20 ns

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

NAND01GW3B2BZA6E

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

128K

128MX8

3 V

20 ns

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

Micron

NAND01GW3B2BZA6F

Numonyx Memory Solutions

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA, BGA63,10X12,32

unknown

EAR99

8542.32.00.51

NAND01GW3B2BZA6F

STMicroelectronics

Check for Price

Yes

Transferred

1.0737 Gbit

128K

128MX8

3 V

25 µs

FLASH

YES

128000000

134.2177 M

ASYNCHRONOUS

2K words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

STMICROELECTRONICS

BGA

TFBGA, BGA63,10X12,32

compliant

EAR99

8542.32.00.51

1 2 Next