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NAND01GW3B2BZA6E
Numonyx Memory Solutions
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 25 µs | FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 225 | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | 1.05 mm | 11 mm | 9 mm | NUMONYX | BGA | TFBGA, BGA63,10X12,32 | 63 | unknown | EAR99 | 8542.32.00.51 | ||||
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NAND01GW3B2BZA6E
Micron Technology Inc
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Check for Price | Yes | Yes | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 20 ns | FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | e1 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.05 mm | 12 mm | 9.5 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA63,10X12,32 | 63 | compliant | EAR99 | 8542.32.00.51 | Micron | |||||
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NAND01GW3B2BZA6E
STMicroelectronics
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Check for Price | Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 25 µs | FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.05 mm | 11 mm | 9 mm | STMICROELECTRONICS | BGA | TFBGA, BGA63,10X12,32 | 63 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics |