Findchips: Parametric Search Results for S25FS512SDSBHV210


Select Parts		Part Number

		S25FS512SDSBHV210 Cypress Semiconductor
		S25FS512SDSBHV210 Infineon Technologies AG
		S25FS512SDSBHV210 Spansion

			Most Relevant					Technical																			Compliance		Operating Conditions						Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Protection	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Samacsys Manufacturer

$9.6600

Yes

Transferred

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.51

Check for Price

Yes

Active

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

100 µA

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

BGA-24

Infineon

Check for Price

Transferred

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

FBGA-24

Compare

S25FS512SDSBHV210

Cypress Semiconductor

$9.6600

Yes

Transferred

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.51

S25FS512SDSBHV210

Infineon Technologies AG

Check for Price

Yes

Active

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

100 µA

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

BGA-24

Infineon

S25FS512SDSBHV210

Spansion

Check for Price

Transferred

536.8709 Mbit

64MX8

1.8 V

80 MHz

FLASH

100000 Write/Erase Cycles

64000000

67.1089 M

SYNCHRONOUS

3-STATE

SERIAL

1.8 V

QSPI

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

105 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

FBGA-24

Parametric results for: S25FS512SDSBHV210 under Flash Memories