Findchips: Parametric Search Results for S29AL008D55BAN021

Parametric results for: S29AL008D55BAN021 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		S29AL008D55BAIR22 Spansion
		S29AL008D55BAIR20 AMD
		S29AL008D55BAIR10 Spansion
		S29AL008D55BAIR13 Spansion
		S29AL008D55BAIR12 AMD
		S29AL008D55BAIR20 Spansion
		S29AL008D55BAIR22 Cypress Semiconductor
		S29AL008D55BAIR10 AMD
		S29AL008D55BAIR22 AMD
		S29AL008D55BAIR23 Cypress Semiconductor

			Most Relevant						Technical																							Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA,

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA,

compliant

EAR99

8542.32.00.51

1 2 Next

Compare

S29AL008D55BAIR22

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

S29AL008D55BAIR20

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29AL008D55BAIR10

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

S29AL008D55BAIR13

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

S29AL008D55BAIR12

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

S29AL008D55BAIR20

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, FBGA-48

not_compliant

EAR99

8542.32.00.51

S29AL008D55BAIR22

Cypress Semiconductor

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA,

compliant

EAR99

8542.32.00.51

S29AL008D55BAIR10

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

S29AL008D55BAIR22

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,15

512000

524.288 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29AL008D55BAIR23

Cypress Semiconductor

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

35 µA

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA,

compliant

EAR99

8542.32.00.51

1 2 Next