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S29AL016D70BAI023
Cypress Semiconductor
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Check for Price | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 5 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | CYPRESS SEMICONDUCTOR CORP | 8.15 X 6.15 MM, FBGA-48 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||
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S29AL016D70BAI023
AMD
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Check for Price | No | Transferred | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | ADVANCED MICRO DEVICES INC | FBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | ||||||||
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S29AL016D70BAI023
Spansion
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Check for Price | No | No | Obsolete | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | 8.15 X 6.15 MM, FBGA-48 | not_compliant | EAR99 | 8542.32.00.51 | BGA | 48 |