Filter Your Search
1 - 10 of 20 results
![]() |
S29GL01GS10DHI020
Spansion
|
$6.9600 | Yes | Transferred | 1.0737 Gbit | 8 | 64K | 128MX8 | 3 V | 100 ns | FLASH | YES | YES | YES | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16 words | PARALLEL | 2.7 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | SPANSION INC | BGA | LEAD FREE, PACKAGE | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | ||||||||||||||
|
S29GL01GS10DHI020
Infineon Technologies AG
|
$11.7933 | Yes | Active | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 100 ns | FLASH | 20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES | 1 | YES | YES | YES | 2 | 100000 Write/Erase Cycles | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NAND TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | INFINEON TECHNOLOGIES AG | compliant | Infineon | |||||||||||
|
S29GL01GS10DHI010
Cypress Semiconductor
|
$12.2900 | Yes | Transferred | 1.0737 Gbit | 8 | 64K | 128MX8 | 3 V | 100 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||
|
S29GL01GS10DHI020
Cypress Semiconductor
|
$12.4394 | Yes | Transferred | 1.0737 Gbit | 8 | 64K | 128MX8 | 3 V | 100 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16 words | PARALLEL | 3 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||
|
IS29GL01GS-10DHI02
Integrated Silicon Solution Inc
|
Check for Price | Active | 1.0737 Gbit | 8 | 128MX8 | 3 V | 100 ns | FLASH | BOTTOM/TOP | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | S-PBGA-B64 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | INTEGRATED SILICON SOLUTION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||
|
IS29GL01GS-10DHI02-TR
Integrated Silicon Solution Inc
|
Check for Price | Active | 1.0737 Gbit | 8 | 128MX8 | 3 V | 100 ns | FLASH | BOTTOM/TOP | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | S-PBGA-B64 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | INTEGRATED SILICON SOLUTION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||
![]() |
S29GL01GS10DHI013
Spansion
|
Check for Price | Yes | Transferred | 1.0737 Gbit | 8 | 64K | 128MX8 | 3 V | 100 ns | FLASH | YES | YES | YES | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16 words | PARALLEL | 2.7 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | SPANSION INC | BGA | LEAD FREE, PACKAGE | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||
|
IS29GL01GS-10DHI01
Integrated Silicon Solution Inc
|
Check for Price | Active | 1.0737 Gbit | 8 | 128MX8 | 3 V | 100 ns | FLASH | BOTTOM/TOP | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | S-PBGA-B64 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | INTEGRATED SILICON SOLUTION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||
|
S29GL01GS10DHI023
Infineon Technologies AG
|
Check for Price | Yes | Active | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 100 ns | FLASH | 20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES | 1 | YES | YES | YES | 2 | 100000 Write/Erase Cycles | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 3-STATE | 32 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NAND TYPE | S-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | INFINEON TECHNOLOGIES AG | compliant | ||||||||||||
![]() |
S29GL01GS10DHI010
Spansion
|
Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 8 | 64K | 128MX8 | 3 V | 100 ns | FLASH | YES | YES | YES | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16 words | PARALLEL | 2.7 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 9 mm | 9 mm | SPANSION INC | BGA | LEAD FREE, PACKAGE | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion |