Findchips: Parametric Search Results for S29GL256P90TFIV13


Select Parts		Part Number

		S29GL256P90TFIV13 Cypress Semiconductor
		S29GL256P90TFIV13 Spansion

			Most Relevant					Technical															Compliance		Operating Conditions		Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Boot Block	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

3 V

90 ns

FLASH

BOTTOM/TOP

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HTSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

268.4355 Mbit

16MX16

3 V

90 ns

FLASH

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HTSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

HTSSOP,

unknown

EAR99

8542.32.00.51

TSOP1

Compare

S29GL256P90TFIV13

Cypress Semiconductor

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

3 V

90 ns

FLASH

BOTTOM/TOP

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HTSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56

compliant

EAR99

8542.32.00.51

S29GL256P90TFIV13

Spansion

Check for Price

Transferred

268.4355 Mbit

16MX16

3 V

90 ns

FLASH

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HTSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

HTSSOP,

unknown

EAR99

8542.32.00.51

TSOP1

Parametric results for: S29GL256P90TFIV13 under Flash Memories