Findchips: Parametric Search Results for S29JL064H55BFI003


Select Parts		Part Number

		S29JL064H55BFI003 Cypress Semiconductor
		S29JL064H55BFI003 Spansion
		S29JL064H55BFI003 AMD

			Most Relevant						Technical																						Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

12 X 11 MM, LEAD FREE, FPBGA-63

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

12 X 11 MM, LEAD FREE, FPBGA-63

unknown

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Transferred

67.1089 Mbit

8K,64K

4MX16

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Compare

S29JL064H55BFI003

Cypress Semiconductor

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

12 X 11 MM, LEAD FREE, FPBGA-63

compliant

EAR99

8542.32.00.51

S29JL064H55BFI003

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

12 X 11 MM, LEAD FREE, FPBGA-63

unknown

EAR99

8542.32.00.51

BGA

S29JL064H55BFI003

AMD

Check for Price

Yes

Transferred

67.1089 Mbit

8K,64K

4MX16

55 ns

FLASH

BOTTOM/TOP

YES

16,126

4000000

4.1943 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Parametric results for: S29JL064H55BFI003 under Flash Memories