Findchips: Parametric Search Results for S29PL129N

Parametric results for: S29PL129N under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S29PL129N65GAW000 Cypress Semiconductor
		S29PL129N70GFWW00 Cypress Semiconductor
		S29PL129N65GFI000 Spansion
		S29PL129N70GFWW03 Cypress Semiconductor
		S29PL129N70GFI002 Spansion
		S29PL129N60GFI000 Spansion
		S29PL129N70GFWW02 Spansion
		S29PL129N70TFIR10 Spansion
		S29PL129N70GAI003 Spansion
		S29PL129N70GAWW03 Spansion

				Most Relevant						Technical																						Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Transferred

134.2177 Mbit

8MX16

3 V

65 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

OTHER

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-84

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

65 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-84

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

60 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

LEAD FREE, MO-142EC, TSOP-56

compliant

EAR99

8542.32.00.51

TSOP1

Check for Price

Obsolete

134.2177 Mbit

8MX16

3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

VFBGA, BGA64,10X12,32

compliant

EAR99

8542.32.00.51

BGA

1 2 3 4 5 Next

Compare

S29PL129N65GAW000

Cypress Semiconductor

Check for Price

Transferred

134.2177 Mbit

8MX16

3 V

65 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

OTHER

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64

compliant

EAR99

8542.32.00.51

S29PL129N70GFWW00

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-84

compliant

EAR99

8542.32.00.51

S29PL129N65GFI000

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

65 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

S29PL129N70GFWW03

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-84

compliant

EAR99

8542.32.00.51

S29PL129N70GFI002

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

S29PL129N60GFI000

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

60 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

S29PL129N70GFWW02

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.51

BGA

S29PL129N70TFIR10

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3.3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

LEAD FREE, MO-142EC, TSOP-56

compliant

EAR99

8542.32.00.51

TSOP1

S29PL129N70GAI003

Spansion

Check for Price

Obsolete

134.2177 Mbit

8MX16

3 V

70 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.1 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-64

compliant

EAR99

8542.32.00.51

BGA

S29PL129N70GAWW03

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

32K,128K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

8,62

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

40 µA

55 µA

3.1 V

2.7 V

CMOS

COMMERCIAL EXTENDED

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

VFBGA, BGA64,10X12,32

compliant

EAR99

8542.32.00.51

BGA

1 2 3 4 5 Next