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S29WS256N0SBFW113
Spansion
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 16K,64K | 16MX16 | 1.8 V | 70 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | BOTTOM/TOP | YES | YES | YES | 1 | 8,254 | 16000000 | 16.7772 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 5 µA | 66 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 84 | PLASTIC/EPOXY | VFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 11.6 mm | 8 mm | SPANSION INC | BGA | 11.60 X 8 MM, LEAD FREE, PLASTIC, FBGA-84 | 84 | unknown | EAR99 | 8542.32.00.51 | ||
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S29WS256N0SBFW113
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 16K,64K | 16MX16 | 1.8 V | 70 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | BOTTOM/TOP | YES | YES | YES | 1 | 8,254 | 16000000 | 16.7772 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 5 µA | 66 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 84 | PLASTIC/EPOXY | VFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 11.6 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | 11.60 X 8 MM, LEAD FREE, PLASTIC, FBGA-84 | compliant | EAR99 | 8542.32.00.51 | ||||
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S29WS256N0SBFW113
AMD
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 16K,64K | 16MX16 | 1.8 V | 9 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 8,254 | 16000000 | 16.7772 M | PARALLEL | 5 µA | 66 µA | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA84,10X12,32 | unknown | EAR99 | 8542.32.00.51 |