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S71NS064NA0BFWSY3
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 52.5 µA | CMOS | OTHER | R-PBGA-B44 | Not Qualified | 85 °C | -25 °C | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA44,8X14,20 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71NS064NA0BFWSW0
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 52.5 µA | CMOS | OTHER | R-PBGA-B44 | Not Qualified | 85 °C | -25 °C | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA44,8X14,20 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71NS064NA0BFWSN3
Cypress Semiconductor
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Check for Price | Active | CYPRESS SEMICONDUCTOR CORP | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
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S71NS064NA0BFWSN3
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 52.5 µA | CMOS | OTHER | R-PBGA-B44 | Not Qualified | 85 °C | -25 °C | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA44,8X14,20 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71NS064NA0BFWMM3
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B44 | Not Qualified | e2 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | 1.2 mm | 7.7 mm | 6.285 mm | SPANSION INC | 7.70 X 6.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44 | unknown | EAR99 | 8542.32.00.71 | BGA | 44 | |||||||
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S71NS064NA0BFWMF3
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B44 | Not Qualified | e2 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | 1.2 mm | 7.7 mm | 6.285 mm | SPANSION INC | 7.70 X 6.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44 | unknown | EAR99 | 8542.32.00.71 | BGA | 44 | |||||||
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S71NS064NA0BFWSZ2
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.2 mm | 7.7 mm | 6.285 mm | SPANSION INC | 9.20 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44 | unknown | EAR99 | 8542.32.00.71 | BGA | 44 | |||||||
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S71NS064NA0BFWMF2
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 52.5 µA | CMOS | OTHER | R-PBGA-B44 | Not Qualified | 85 °C | -25 °C | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA44,8X14,20 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71NS064NA0BFWMZ3
Cypress Semiconductor
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Check for Price | Active | CYPRESS SEMICONDUCTOR CORP | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
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S71NS064NA0BFWSN3
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.2 mm | 7.7 mm | 6.285 mm | SPANSION INC | 9.20 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-44 | unknown | EAR99 | 8542.32.00.71 | BGA | 44 |