Findchips: Parametric Search Results for S71NS256NC0BJWRN2


Select Parts		Part Number

		S71NS256NC0BJWVN1 Spansion
		S71NS256NC0BJWVN1 Cypress Semiconductor
		S71NS256NC0BJWVN2 Spansion
		S71NS256NC0BJWVN0 Spansion
		S71NS256NC0BJWVN3 Spansion

				Most Relevant				Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

CYPRESS SEMICONDUCTOR CORP

10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

Compare

S71NS256NC0BJWVN1

Spansion

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

S71NS256NC0BJWVN1

Cypress Semiconductor

Check for Price

Yes

Transferred

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

CYPRESS SEMICONDUCTOR CORP

10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

compliant

EAR99

8542.32.00.71

S71NS256NC0BJWVN2

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

S71NS256NC0BJWVN0

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

S71NS256NC0BJWVN3

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 16M X 16

16000000

16.7772 M

SYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

500 µm

BOTTOM

1.2 mm

11 mm

10 mm

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

unknown

EAR99

8542.32.00.71

Parametric results for: S71NS256NC0BJWRN2 under Other Memory ICs