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Manufacturer Part Number: s71pl032j04bai0
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S71PL032J04BAI0B4
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3 V MEMORY CIRCUIT STATIC RAM IS ORGANIZED AS 256K X 16 1 2000000 2.0972 M ASYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 3 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, 56 compliant EAR99 8542.32.00.71
S71PL032J04BAI0B3
 AMD 		Check for Price Transferred ADVANCED MICRO DEVICES INC , unknown EAR99 8542.32.00.71
S71PL032J04BAI0F4
 AMD 		Check for Price Yes Obsolete 70 ns MEMORY CIRCUIT FLASH+SRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL032J04BAI0F0
 Spansion 		Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 70 ns MEMORY CIRCUIT SRAM IS ORGANIZED AS 256K X 16 FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 5 µA 70 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71PL032J04BAI0K2
 Spansion 		Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 70 ns MEMORY CIRCUIT SRAM IS ORGANIZED AS 256K X 16 FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 5 µA 70 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71PL032J04BAI0B4
 AMD 		Check for Price Transferred ADVANCED MICRO DEVICES INC , unknown EAR99 8542.32.00.71
S71PL032J04BAI0F0
 AMD 		Check for Price Yes Obsolete 3 V 70 ns MEMORY CIRCUIT FLASH+SRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL032J04BAI0K3
 Cypress Semiconductor 		Check for Price Yes Active 3 V 3 V 70 ns MEMORY CIRCUIT FLASH+SRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
S71PL032J04BAI0F2
 Spansion 		Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 70 ns MEMORY CIRCUIT SRAM IS ORGANIZED AS 256K X 16 FLASH+SRAM 1 2000000 2.0972 M ASYNCHRONOUS 5 µA 70 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 56 PLASTIC/EPOXY TFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC BGA TFBGA, BGA56,8X8,32 56 compliant EAR99 8542.32.00.71
S71PL032J04BAI0K0
 AMD 		Check for Price Yes Obsolete 3 V 70 ns MEMORY CIRCUIT FLASH+SRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
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