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S71WS256ND0BAWYM2
Cypress Semiconductor
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Check for Price | Yes | Active | 1.8 V | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 70 µA | 66 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||
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S71WS256ND0BAWYZ0
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 66 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | compliant | FBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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S71WS256ND0BAWYM3
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 66 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | compliant | FBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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S71WS256ND0BAWYP2
Cypress Semiconductor
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Check for Price | Yes | Active | 1.8 V | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 70 µA | 54 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||
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S71WS256ND0BAWE62
Spansion
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Check for Price | No | Transferred | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 8M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | FLASH+PSRAM | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | R-PBGA-B84 | e0 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 9 mm | SPANSION INC | unknown | , | EAR99 | 8542.32.00.71 | |||||||||||
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S71WS256ND0BAWE31
AMD
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Check for Price | Yes | Active | 1.8 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 66 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | compliant | FBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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S71WS256ND0BAWYP3
Spansion
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 80 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | FLASH+PSRAM | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 70 µA | 54 µA | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 9 mm | SPANSION INC | compliant | TFBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | BGA | 84 | |||
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S71WS256ND0BAWE72
Spansion
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Check for Price | No | Obsolete | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 8M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | FLASH+PSRAM | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e0 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 9 mm | SPANSION INC | compliant | TFBGA, | EAR99 | 8542.32.00.71 | BGA | 84 | |||||||
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S71WS256ND0BAWYP3
AMD
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Check for Price | Yes | Active | 1.8 V | 80 ns | MEMORY CIRCUIT | FLASH+PSRAM | 40 µA | 66 µA | CMOS | OTHER | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | compliant | FBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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S71WS256ND0BAWYK0
Spansion
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 80 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | FLASH+PSRAM | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 70 µA | 54 µA | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 9 mm | SPANSION INC | compliant | TFBGA, BGA84,10X12,32 | EAR99 | 8542.32.00.71 | BGA | 84 |