Parametric results for: S71WS256ND0BAWA70 under Other Memory ICs

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Manufacturer Part Number: s71ws256nd0baw
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S71WS256ND0BAWYM2
Cypress Semiconductor
Check for Price Yes Active 1.8 V 1.8 V 80 ns MEMORY CIRCUIT FLASH+PSRAM 70 µA 66 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
S71WS256ND0BAWYZ0
AMD
Check for Price Yes Active 1.8 V 80 ns MEMORY CIRCUIT FLASH+PSRAM 40 µA 66 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA84,10X12,32 EAR99 8542.32.00.71
S71WS256ND0BAWYM3
AMD
Check for Price Yes Active 1.8 V 80 ns MEMORY CIRCUIT FLASH+PSRAM 40 µA 66 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA84,10X12,32 EAR99 8542.32.00.71
S71WS256ND0BAWYP2
Cypress Semiconductor
Check for Price Yes Active 1.8 V 1.8 V 80 ns MEMORY CIRCUIT FLASH+PSRAM 70 µA 54 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
S71WS256ND0BAWE62
Spansion
Check for Price No Transferred 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 8M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE FLASH+PSRAM 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS R-PBGA-B84 e0 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC unknown , EAR99 8542.32.00.71
S71WS256ND0BAWE31
AMD
Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+PSRAM 40 µA 66 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA84,10X12,32 EAR99 8542.32.00.71
S71WS256ND0BAWYP3
Spansion
Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V 80 ns MEMORY CIRCUIT PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE FLASH+PSRAM 1 16000000 16.7772 M ASYNCHRONOUS 70 µA 54 µA 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e1 3 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC compliant TFBGA, BGA84,10X12,32 EAR99 8542.32.00.71 BGA 84
S71WS256ND0BAWE72
Spansion
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT PSRAM IS ORGANIZED AS 8M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE FLASH+PSRAM 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e0 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC compliant TFBGA, EAR99 8542.32.00.71 BGA 84
S71WS256ND0BAWYP3
AMD
Check for Price Yes Active 1.8 V 80 ns MEMORY CIRCUIT FLASH+PSRAM 40 µA 66 µA CMOS OTHER R-PBGA-B84 Not Qualified 85 °C -25 °C 84 PLASTIC/EPOXY FBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA84,10X12,32 EAR99 8542.32.00.71
S71WS256ND0BAWYK0
Spansion
Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V 80 ns MEMORY CIRCUIT PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE FLASH+PSRAM 1 16000000 16.7772 M ASYNCHRONOUS 70 µA 54 µA 1.95 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e1 3 85 °C -25 °C 84 PLASTIC/EPOXY TFBGA BGA84,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC compliant TFBGA, BGA84,10X12,32 EAR99 8542.32.00.71 BGA 84