Findchips: Parametric Search Results for SST39WF1601-70-4C-B3KE


Select Parts		Part Number

		SST39WF1601-70-4C-B3KE Microchip Technology Inc
		SST39WF1601-70-4C-B3KE-T Microchip Technology Inc
		SST39WF1601-70-4C-B3KE Silicon Storage Technology

				Most Relevant						Technical																									Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Data Retention Time-Min	Endurance	Number of Functions	Number of Ports	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$1.8719

Yes

Active

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM BOOT-BLOCK

BOTTOM

YES

100

100000 Write/Erase Cycles

512

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

40 µA

25 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

MICROCHIP TECHNOLOGY INC

BGA

6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

compliant

3A991.B.1.A

8542.32.00.51

Microchip

$3.0150

Yes

Active

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM BOOT-BLOCK

BOTTOM

YES

100

100000 Write/Erase Cycles

512

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

40 µA

25 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

MICROCHIP TECHNOLOGY INC

compliant

3A991.B.1.A

8542.32.00.51

Check for Price

Yes

Transferred

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM

YES

512

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

40 µA

10 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SILICON STORAGE TECHNOLOGY INC

BGA

6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

unknown

EAR99

8542.32.00.51

Compare

SST39WF1601-70-4C-B3KE

Microchip Technology Inc

$1.8719

Yes

Active

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM BOOT-BLOCK

BOTTOM

YES

100

100000 Write/Erase Cycles

512

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

40 µA

25 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

MICROCHIP TECHNOLOGY INC

BGA

6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

compliant

3A991.B.1.A

8542.32.00.51

Microchip

SST39WF1601-70-4C-B3KE-T

Microchip Technology Inc

$3.0150

Yes

Active

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM BOOT-BLOCK

BOTTOM

YES

100

100000 Write/Erase Cycles

512

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

1.8 V

40 µA

25 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

MICROCHIP TECHNOLOGY INC

compliant

3A991.B.1.A

8542.32.00.51

SST39WF1601-70-4C-B3KE

Silicon Storage Technology

Check for Price

Yes

Transferred

16.7772 Mbit

1MX16

1.8 V

70 ns

FLASH

BOTTOM

YES

512

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

40 µA

10 µA

1.95 V

1.65 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SILICON STORAGE TECHNOLOGY INC

BGA

6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

unknown

EAR99

8542.32.00.51

Parametric results for: SST39WF1601-70-4C-B3KE under Flash Memories