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Parametric » Memory » Flash Memories

Parametric results for: TC58NYG1S3HBAI4 under Flash Memories

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Select Parts		Part Number

		TC58NYG1S3HBAI4 Toshiba America Electronic Components
		TC58NYG1S3HBAI4 KIOXIA

		Most Relevant					Technical																	Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Cycle Time-Max (tWC)	Write Protection	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

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Transferred

2.1475 Gbit

8

256MX8

1.8 V

FLASH

1

256000000

268.4355 M

ASYNCHRONOUS

SERIAL

1.8 V

CMOS

INDUSTRIAL

SLC NAND TYPE

HARDWARE

R-PBGA-B63

85 °C

-40 °C

63

PLASTIC/EPOXY

BGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

9 mm

TOSHIBA CORP

BGA

VFBGA,

63

unknown

EAR99

8542.32.00.51

Toshiba

Check for Price

Active

2.1475 Gbit

8

256MX8

1.8 V

25 ns

FLASH

1

256000000

268.4355 M

ASYNCHRONOUS

3-STATE

SERIAL

1.8 V

50 µA

30 µA

1.95 V

1.7 V

CMOS

INDUSTRIAL

NAND TYPE

25 ns

HARDWARE

R-PBGA-B63

85 °C

-40 °C

63

PLASTIC/EPOXY

VFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

9 mm

KIOXIA HOLDINGS CORP

VFBGA,

unknown

EAR99

8542.32.00.51

Compare

TC58NYG1S3HBAI4

Toshiba America Electronic Components

Check for Price

Transferred

2.1475 Gbit

8

256MX8

1.8 V

FLASH

1

256000000

268.4355 M

ASYNCHRONOUS

SERIAL

1.8 V

CMOS

INDUSTRIAL

SLC NAND TYPE

HARDWARE

R-PBGA-B63

85 °C

-40 °C

63

PLASTIC/EPOXY

BGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

9 mm

TOSHIBA CORP

BGA

VFBGA,

63

unknown

EAR99

8542.32.00.51

Toshiba

TC58NYG1S3HBAI4

KIOXIA

Check for Price

Active

2.1475 Gbit

8

256MX8

1.8 V

25 ns

FLASH

1

256000000

268.4355 M

ASYNCHRONOUS

3-STATE

SERIAL

1.8 V

50 µA

30 µA

1.95 V

1.7 V

CMOS

INDUSTRIAL

NAND TYPE

25 ns

HARDWARE

R-PBGA-B63

85 °C

-40 °C

63

PLASTIC/EPOXY

VFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

9 mm

KIOXIA HOLDINGS CORP

VFBGA,

unknown

EAR99

8542.32.00.51