Parametric results for: TC850CLW under Analog to Digital Converters
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TC850CLW713
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 5 V | 3.5 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | 3.2 V | -5 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | e3 | 1 | 70 °C | 245 | TS 16949 | 40 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 16.585 mm | 4.57 mm | 16.585 mm | MICROCHIP TECHNOLOGY INC | LCC | QCCJ, LDCC44,.7SQ | 44 | compliant | EAR99 | 8542.39.00.01 | Microchip | |||
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TC850CLW
Microchip Technology Inc
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$44.9557 | Yes | Yes | Active | 5 V | 3.5 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | 3.2 V | -5 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | e3 | 1 | 70 °C | 260 | TS 16949 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 4.57 mm | 16.585 mm | MICROCHIP TECHNOLOGY INC | LCC | QCCJ, DIP40,.6 | 44 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||
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TC850CLW723
Telcom Semiconductor Inc
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Check for Price | Transferred | 5 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | -5 V | 1 | BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | LDCC44,.7SQ | SQUARE | CHIP CARRIER | J BEND | QUAD | TELCOM SEMICONDUCTOR INC | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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TC850CLW
Teledyne Technologies Inc
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Check for Price | Obsolete | 5 V | 5 V | 1 | 0.006 % | 15 | YES | ADC, MULTI-SLOPE | -5 V | -5 V | 1 | OFFSET BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | LDCC44,.7SQ | SQUARE | CHIP CARRIER | J BEND | QUAD | TELEDYNE COMPONENTS | , | unknown | 8542.39.00.01 | |||||||||||||||||||
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TC850CLWTR
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | 3.5 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | -3.5 V | -5 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | e3 | 1 | 70 °C | 245 | 40 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 16.585 mm | 4.57 mm | 16.585 mm | MICROCHIP TECHNOLOGY INC | LCC | QCCJ, LDCC44,.7SQ | 44 | compliant | 8542.39.00.01 | ||||||
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TC850CLW713
Telcom Semiconductor Inc
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Check for Price | Transferred | 5 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | -5 V | 1 | BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | LDCC44,.7SQ | SQUARE | CHIP CARRIER | J BEND | QUAD | TELCOM SEMICONDUCTOR INC | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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TC850CLW
Telcom Semiconductor Inc
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Check for Price | No | Transferred | 5 V | 3.28 V | 1 | 0.0061 % | 15 | YES | ADC, MULTI-SLOPE | -5 V | 1 | BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | S-PQCC-J44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | TELCOM SEMICONDUCTOR INC | PLASTIC, LCC-44 | unknown | 8542.39.00.01 |