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TC850CPL
Microchip Technology Inc
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$38.1855 | Yes | Yes | Active | 5 V | 3.5 V | 1 | 0.0061 % | 15 | NO | ADC, MULTI-SLOPE | 3.2 V | -5 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDIP-T40 | Not Qualified | e3 | 70 °C | TS 16949 | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 5.08 mm | 51.97 mm | MICROCHIP TECHNOLOGY INC | DIP | PLASTIC, DIP-40 | 40 | compliant | EAR99 | 8542.39.00.01 | Microchip | |||
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TC850CPL
Teledyne Technologies Inc
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Check for Price | Obsolete | 5 V | 5 V | 1 | 0.006 % | 15 | NO | ADC, MULTI-SLOPE | -5 V | -5 V | 1 | OFFSET BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | TELEDYNE COMPONENTS | DIP-40 | unknown | 8542.39.00.01 | |||||||||||||||||
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TC850CPL
Telcom Semiconductor Inc
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Check for Price | No | Transferred | 5 V | 3.28 V | 1 | 0.0061 % | 15 | NO | ADC, MULTI-SLOPE | -5 V | 1 | BINARY | 3.5 mA | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | TELCOM SEMICONDUCTOR INC | PLASTIC, DIP-40 | unknown | 8542.39.00.01 |