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TE28F320C3BC70
Intel Corporation
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Check for Price | No | Transferred | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 70 ns | FLASH | USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK | BOTTOM | YES | YES | NO | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 3 V | 5 µA | 55 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PDSO-G48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | INTEL CORP | TSOP | 12 X 20 MM, TSOP-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||
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TE28F320C3BC70
Numonyx Memory Solutions
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 70 ns | FLASH | USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK | BOTTOM | YES | YES | NO | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 3 V | 20 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | NUMONYX | TSOP | 12 X 20 MM, TSOP-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||
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TE28F320C3BC70
Micron Technology Inc
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM | YES | YES | NO | 8,63 | 2000000 | 2.0972 M | PARALLEL | 3 V | 20 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICRON TECHNOLOGY INC | 12 X 20 MM, TSOP-48 | unknown | EAR99 | 8542.32.00.51 |