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VC-806-HDE-KAAN-200M000000_SNPBDIP
Vectron International
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Check for Price | No | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT | 600 ps | NO | 600 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e0 | 85 °C | -40 °C | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | Tin/Lead (Sn/Pb) | 5.0mm x 3.2mm x 1.3mm | VECTRON INTERNATIONAL | SOLCC6,.12 | compliant | Clock | |||||
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VC-806-HDE-KAAN-200M000000TR
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT | 700 ps | NO | 700 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | 85 °C | -40 °C | MIL-STD-883 | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | 5.0mm x 3.2mm x 1.3mm | MICROCHIP TECHNOLOGY INC | compliant | Clock | |||||||
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VC-806-HDE-KAAN-200M000000
Vectron International
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Check for Price | Yes | Yes | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT | 600 ps | NO | 600 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e4 | Not Qualified | 85 °C | -40 °C | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | Gold (Au) - with Nickel (Ni) barrier | 5.0mm x 3.2mm x 1.3mm | VECTRON INTERNATIONAL | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6 | compliant | Clock | |||
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VC-806-HDE-KAAN-200M000000_SNPB
Vectron International
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Check for Price | Yes | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; COMPLEMENTARY OUTPUT | 700 ps | NO | 700 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e0 | 85 °C | -40 °C | MIL-STD-883 | SURFACE MOUNT | 6 | DILCC6,.12,50 | YES | Tin/Lead (Sn/Pb) | 5 mm x 3.2 mm x 1.3 mm | VECTRON INTERNATIONAL | DILCC6,.12,50 | compliant | Clock | |||||
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VC-806-HDE-KAAN-200M000000_SNPBDIP
Microsemi Corporation
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Check for Price | No | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT | 600 ps | NO | 600 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e0 | 85 °C | -40 °C | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | Tin/Lead (Sn/Pb) | 5.0mm x 3.2mm x 1.3mm | MICROSEMI CORP | compliant | Clock | ||||||
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VC-806-HDE-KAAN-200M000000
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT | 600 ps | NO | 600 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e4 | Not Qualified | 85 °C | -40 °C | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | GOLD OVER NICKEL | 5.0mm x 3.2mm x 1.3mm | MICROCHIP TECHNOLOGY INC | compliant | Clock | |||||
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VC-806-HDE-KAAN-200M000000
Microsemi Corporation
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Check for Price | Yes | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT | 600 ps | NO | 600 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e4 | Not Qualified | 85 °C | -40 °C | SURFACE MOUNT | 6 | CERAMIC | SOLCC6,.12 | YES | Gold (Au) - with Nickel (Ni) barrier | 5.0mm x 3.2mm x 1.3mm | MICROSEMI CORP | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6 | compliant | Clock | ||||
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VC-806-HDE-KAAN-200M000000_SNPB
Microsemi Corporation
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Check for Price | Yes | Transferred | 200 MHz | 50 % | 100 OHM | 2.5 V | LVDS | ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; COMPLEMENTARY OUTPUT | 700 ps | NO | 700 ps | 60 mA | 2.625 V | 2.375 V | 55/45 % | e0 | 85 °C | -40 °C | MIL-STD-883 | SURFACE MOUNT | 6 | DILCC6,.12,50 | YES | Tin/Lead (Sn/Pb) | 5 mm x 3.2 mm x 1.3 mm | MICROSEMI CORP | compliant | Clock |