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Manufacturer Part Number: w27e020
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W27E020P-12
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 120 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ PLASTIC, LCC-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E020-12
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 120 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.33 mm 41.91 mm 15.24 mm WINBOND ELECTRONICS CORP DIP 0.600 INCH, PLASTIC, DIP-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E020-70
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 70 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.33 mm 41.91 mm 15.24 mm WINBOND ELECTRONICS CORP DIP 0.600 INCH, PLASTIC, DIP-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E020-90
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 90 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PDIP-T32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.33 mm 41.91 mm 15.24 mm WINBOND ELECTRONICS CORP DIP 0.600 INCH, PLASTIC, DIP-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E020P-70
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 70 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ PLASTIC, LCC-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51
W27E020P-90
 Winbond Electronics Corp 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 90 ns EEPROM NO NO 1 256000 262.144 k ASYNCHRONOUS PARALLEL 12 V 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL NO R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ PLASTIC, LCC-32 32 not_compliant 3A991.B.1.B.1 8542.32.00.51