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Parametric » Memory » EEPROMs

Parametric results for: W27E020P under EEPROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		W27E020P-12 Winbond Electronics Corp
		W27E020P-70 Winbond Electronics Corp
		W27E020P-90 Winbond Electronics Corp

			Most Relevant					Technical																Compliance			Operating Conditions	Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Command User Interface	Data Polling	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

120 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

70 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

90 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51

Compare

Winbond Electronics Corp

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

120 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51

Winbond Electronics Corp

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

70 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51

Winbond Electronics Corp

Check for Price

No

Obsolete

2.0972 Mbit

8

256KX8

5 V

90 ns

EEPROM

NO

NO

1

256000

262.144 k

ASYNCHRONOUS

PARALLEL

12 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

NO

R-PQCC-J32

Not Qualified

e0

70 °C

32

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

WINBOND ELECTRONICS CORP

QFJ

PLASTIC, LCC-32

32

not_compliant

3A991.B.1.B.1

8542.32.00.51