Parametric results for: W39L010 under Flash Memories

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Manufacturer Part Number: w39l010
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W39L010Q-90
Winbond Electronics Corp
Check for Price No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 90 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSSOP TSSOP32,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP TSSOP, TSSOP32,.56,20 32 unknown EAR99 8542.32.00.51
W39L010P-70
Winbond Electronics Corp
Check for Price No No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 70 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ QCCJ, LDCC32,.5X.6 32 unknown EAR99 8542.32.00.51
W39L010P-70B
Winbond Electronics Corp
Check for Price No No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 70 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PQCC-J32 Not Qualified e0 70 °C 225 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.51
W39L010Q-70B
Winbond Electronics Corp
Check for Price No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 70 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G32 Not Qualified e0 70 °C 240 30 32 PLASTIC/EPOXY TSSOP TSSOP32,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP 8 X 14 MM, STSOP-32 32 not_compliant EAR99 8542.32.00.51
W39L010Q-90B
Winbond Electronics Corp
Check for Price No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 90 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G32 Not Qualified e0 70 °C 240 30 32 PLASTIC/EPOXY TSSOP TSSOP32,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP 8 X 14 MM, STSOP-32 32 not_compliant EAR99 8542.32.00.51
W39L010Q-70
Winbond Electronics Corp
Check for Price No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 70 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSSOP TSSOP32,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 12.4 mm 8 mm WINBOND ELECTRONICS CORP TSOP TSSOP, TSSOP32,.56,20 32 unknown EAR99 8542.32.00.51
W39L010P-90B
Winbond Electronics Corp
Check for Price No No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 90 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PQCC-J32 Not Qualified e0 70 °C 225 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.51
W39L010P-90
Winbond Electronics Corp
Check for Price No No Obsolete 1.0486 Mbit 8 4K 128KX8 3.3 V 90 ns FLASH YES YES 1 32 128000 131.072 k ASYNCHRONOUS PARALLEL 3.3 V 50 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.56 mm 13.97 mm 11.43 mm WINBOND ELECTRONICS CORP QFJ QCCJ, LDCC32,.5X.6 32 unknown EAR99 8542.32.00.51