Findchips: Parametric Search Results for W3E32M72S-266SBC


Select Parts		Part Number

		W3E32M72S-266SBC White Electronic Designs Corp
		W3E32M72S-266SBCG Mercury Systems Inc
		W3E32M72S-266SBC Microsemi Corporation
		W3E32M72S-266SBCF Mercury Systems Inc
		W3E32M72S-266SBC Mercury Systems Inc

				Most Relevant								Technical																		Compliance			Operating Conditions	Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Transferred

2.4159 Gbit

32MX72

2.5 V

750 ps

133 MHz

8192

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

25 mA

2 mA

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

208

PLASTIC/EPOXY

BGA

BGA208,11X19,40

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA, BGA208,11X19,40

unknown

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

unknown

EAR99

8542.32.00.36

Check for Price

Transferred

2.4159 Gbit

32MX72

2.5 V

750 ps

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

BOTTOM

MICROSEMI CORP

16 X 22 MM, PLASTIC, BGA-208

unknown

EAR99

8542.32.00.36

BGA

208

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

unknown

EAR99

8542.32.00.36

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

compliant

EAR99

8542.32.00.36

Compare

W3E32M72S-266SBC

White Electronic Designs Corp

Check for Price

Transferred

2.4159 Gbit

32MX72

2.5 V

750 ps

133 MHz

8192

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

25 mA

2 mA

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

208

PLASTIC/EPOXY

BGA

BGA208,11X19,40

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA, BGA208,11X19,40

unknown

W3E32M72S-266SBCG

Mercury Systems Inc

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

unknown

EAR99

8542.32.00.36

W3E32M72S-266SBC

Microsemi Corporation

Check for Price

Transferred

2.4159 Gbit

32MX72

2.5 V

750 ps

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

2.7 V

2.3 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

BOTTOM

MICROSEMI CORP

16 X 22 MM, PLASTIC, BGA-208

unknown

EAR99

8542.32.00.36

BGA

208

W3E32M72S-266SBCF

Mercury Systems Inc

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

unknown

EAR99

8542.32.00.36

W3E32M72S-266SBC

Mercury Systems Inc

Check for Price

Active

2.4159 Gbit

32MX72

2.5 V

266 MHz

FOUR BANK PAGE BURST

DDR1 DRAM

AUTO/SELF REFRESH

COMMON

2,4,8

32000000

33.5544 M

SYNCHRONOUS

YES

2,4,8

2.7 V

2.3 V

CMOS

R-PBGA-B208

70 °C

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.05 mm

22 mm

16 mm

MERCURY SYSTEMS INC

compliant

EAR99

8542.32.00.36

Parametric results for: W3E32M72S-266SBC under DRAMs