Findchips: Parametric Search Results for W3H32M64E-533SB


Select Parts		Part Number

		W3H32M64E-533SBI Microsemi Corporation
		W3H32M64E-533SBC White Electronic Designs Corp
		W3H32M64E-533SBI Mercury Systems Inc
		W3H32M64E-533SBM Microsemi Corporation
		W3H32M64E-533SBM Mercury Systems Inc
		W3H32M64E-533SBC Microsemi Corporation
		W3H32M64E-533SBI White Electronic Designs Corp
		W3H32M64E-533SBM White Electronic Designs Corp

				Most Relevant								Technical															Compliance		Operating Conditions				Physical										Dimensions	Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA

16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

208

unknown

EAR99

8542.32.00.36

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

Check for Price

End Of Life

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

unknown

EAR99

8542.32.00.36

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.36

Check for Price

End Of Life

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

BGA,

unknown

EAR99

8542.32.00.36

Check for Price

Obsolete

2.1475 Gbit

32MX64

1.8 V

650 ps

267 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

1.36 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

BGA

BGA208,11X19,40

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

MICROSEMI CORP

BGA

BGA, BGA208,11X19,40

208

unknown

EAR99

8542.32.00.36

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

Compare

W3H32M64E-533SBI

Microsemi Corporation

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA

16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

208

unknown

EAR99

8542.32.00.36

W3H32M64E-533SBC

White Electronic Designs Corp

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

W3H32M64E-533SBI

Mercury Systems Inc

Check for Price

End Of Life

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

unknown

EAR99

8542.32.00.36

W3H32M64E-533SBM

Microsemi Corporation

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

unknown

EAR99

8542.32.00.36

W3H32M64E-533SBM

Mercury Systems Inc

Check for Price

End Of Life

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

225

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

BGA,

unknown

EAR99

8542.32.00.36

W3H32M64E-533SBC

Microsemi Corporation

Check for Price

Obsolete

2.1475 Gbit

32MX64

1.8 V

650 ps

267 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

1.36 mA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B208

Not Qualified

70 °C

225

208

PLASTIC/EPOXY

BGA

BGA208,11X19,40

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

MICROSEMI CORP

BGA

BGA, BGA208,11X19,40

208

unknown

EAR99

8542.32.00.36

W3H32M64E-533SBI

White Electronic Designs Corp

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

W3H32M64E-533SBM

White Electronic Designs Corp

Check for Price

Transferred

2.1475 Gbit

32MX64

1.8 V

650 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

32000000

33.5544 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

MILITARY

R-PBGA-B208

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.06 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

Parametric results for: W3H32M64E-533SB under DRAMs