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Parametric » Memory » DRAMs

Parametric results for: W3H64M72E-400ESI under DRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		W3H64M72E-400ESI White Electronic Designs Corp
		W3H64M72E-400ESI Microsemi Corporation
		W3H64M72E-400ESI Mercury Systems Inc

				Most Relevant						Technical												Compliance		Operating Conditions				Physical									Dimensions	Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Access Mode	Memory IC Type	Additional Feature	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Self Refresh	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	Part Package Code	Pin Count	ECCN Code	HTS Code

Check for Price

No

Transferred

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.64 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

Check for Price

No

No

Transferred

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

30

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

compliant

BGA

208

EAR99

8542.32.00.36

Check for Price

No

Obsolete

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

30

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

BGA,

compliant

EAR99

8542.32.00.36

Compare

W3H64M72E-400ESI

White Electronic Designs Corp

Check for Price

No

Transferred

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1 mm

BOTTOM

3.64 mm

WHITE ELECTRONIC DESIGNS CORP

BGA,

unknown

W3H64M72E-400ESI

Microsemi Corporation

Check for Price

No

No

Transferred

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

30

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MICROSEMI CORP

BGA,

compliant

BGA

208

EAR99

8542.32.00.36

W3H64M72E-400ESI

Mercury Systems Inc

Check for Price

No

Obsolete

4.8318 Gbit

72

64MX72

1.8 V

600 ps

MULTI BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

1

1

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B208

Not Qualified

85 °C

-40 °C

225

30

208

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

MERCURY SYSTEMS INC

BGA,

compliant

EAR99

8542.32.00.36