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W631GG6KB11I
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | MULTI BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.575 V | 1.425 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 96 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 9 mm | WINBOND ELECTRONICS CORP | TFBGA, | compliant | EAR99 | 8542.32.00.32 | ||||||||||||||||
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W631GG6KB-11
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 195 ps | 933 MHz | 8192 | MULTI BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 8 | 14 mA | 430 µA | 1.575 V | 1.425 V | CMOS | OTHER | R-PBGA-B96 | Not Qualified | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 9 mm | WINBOND ELECTRONICS CORP | WBGA-96 | compliant | EAR99 | 8542.32.00.32 | BGA | 96 | Winbond |