Findchips: Parametric Search Results for W9751G8KB


Select Parts		Part Number

		W9751G8KB-18 Winbond Electronics Corp
		W9751G8KB-3 Winbond Electronics Corp
		W9751G8KB-25I Winbond Electronics Corp
		W9751G8KB-25 Winbond Electronics Corp
		W9751G8KB25I Winbond Electronics Corp

				Most Relevant						Technical												Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Access Mode	Memory IC Type	Additional Feature	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Self Refresh	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count	Samacsys Manufacturer

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

350 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

450 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

Check for Price

Active

WINBOND ELECTRONICS CORP

compliant

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

400 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

BGA

Winbond

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

400 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

Winbond

Compare

W9751G8KB-18

Winbond Electronics Corp

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

350 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

W9751G8KB-3

Winbond Electronics Corp

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

450 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

W9751G8KB-25I

Winbond Electronics Corp

Check for Price

Active

WINBOND ELECTRONICS CORP

compliant

W9751G8KB-25

Winbond Electronics Corp

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

400 ps

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

85 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

BGA

Winbond

W9751G8KB25I

Winbond Electronics Corp

Check for Price

Yes

Obsolete

536.8709 Mbit

64MX8

1.8 V

400 ps

FOUR BANK PAGE BURST

DDR DRAM

AUTO/SELF REFRESH

64000000

67.1089 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

WINBOND ELECTRONICS CORP

WBGA-60

compliant

EAR99

8542.32.00.28

Winbond

Parametric results for: W9751G8KB under DRAMs