Findchips: Parametric Search Results for W9825G6JB


Select Parts		Part Number

		W9825G6JB-6A Winbond Electronics Corp
		W9825G6JB-75 Winbond Electronics Corp
		W9825G6JB-6 Winbond Electronics Corp
		W9825G6JB-6K Winbond Electronics Corp
		W9825G6JB-6I Winbond Electronics Corp

			Most Relevant								Technical																		Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5.4 ns

133 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

75 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PBGA-B54

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PBGA-B54

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

Winbond

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

5 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA-54

compliant

EAR99

8542.32.00.24

Winbond

Compare

W9825G6JB-6A

Winbond Electronics Corp

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

W9825G6JB-75

Winbond Electronics Corp

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5.4 ns

133 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

75 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PBGA-B54

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

W9825G6JB-6

Winbond Electronics Corp

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PBGA-B54

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

Winbond

W9825G6JB-6K

Winbond Electronics Corp

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

5 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA54,9X9,32

compliant

EAR99

8542.32.00.24

W9825G6JB-6I

Winbond Electronics Corp

Check for Price

Yes

Not Recommended

268.4355 Mbit

16MX16

3.3 V

5 ns

166 MHz

8192

FOUR BANK PAGE BURST

SYNCHRONOUS DRAM

AUTO/SELF REFRESH

COMMON

1,2,4,8

16000000

16.7772 M

SYNCHRONOUS

3-STATE

YES

1,2,4,8,FP

2 mA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PBGA-B54

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA54,9X9,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA-54

compliant

EAR99

8542.32.00.24

Winbond

Parametric results for: W9825G6JB under DRAMs