Parametric results for: WE128K32P-300H1IA under EEPROMs

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Manufacturer Part Number: we128k32p300h1ia
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WE128K32P300H1IA
White Electronic Designs Corp
Check for Price No Transferred 4.1943 Mbit 32 128KX32 5 V 300 ns EEPROM MODULE ALSO CONFIGURABLE AS 512K X 8 16 1 128000 131.072 k SYNCHRONOUS PARALLEL 5 V 5.5 V 4.5 V CMOS INDUSTRIAL 10 ms S-CPGA-P66 Not Qualified 85 °C -40 °C 66 CERAMIC, METAL-SEALED COFIRED PGA SQUARE GRID ARRAY NO PIN/PEG 2.54 mm PERPENDICULAR 4.6 mm 27.3 mm 27.3 mm WHITE ELECTRONIC DESIGNS CORP 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 unknown 3A991.B.1.B.1 8542.32.00.51
WE128K32P-300H1IA
Microsemi Corporation
Check for Price No Transferred 4.1943 Mbit 32 128KX32 5 V 300 ns EEPROM MODULE ALSO CONFIGURABLE AS 512K X 8 16 1 128000 131.072 k SYNCHRONOUS PARALLEL 5 V 5.5 V 4.5 V CMOS INDUSTRIAL 10 ms S-CPGA-P66 Not Qualified 85 °C -40 °C 66 CERAMIC, METAL-SEALED COFIRED PGA SQUARE GRID ARRAY NO PIN/PEG 2.54 mm PERPENDICULAR 4.6 mm 27.3 mm 27.3 mm MICROSEMI CORP PGA, compliant 3A991.B.1.B.1 8542.32.00.51
WE128K32P-300H1IA
Mercury Systems Inc
Check for Price Active EEPROM MODULE 5 V MERCURY SYSTEMS INC , unknown EAR99 8542.32.00.51
WE128K32P-300H1IA
White Microelectronics
Check for Price Transferred 4.1943 Mbit 32 128KX32 5 V 300 ns EEPROM MODULE USER CONFIGURABLE AS 512K X 8 16 1 128000 131.072 k ASYNCHRONOUS PARALLEL 5 V 5.5 V 4.5 V CMOS INDUSTRIAL 10 ms S-CPGA-P66 Not Qualified 85 °C -40 °C 66 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY NO PIN/PEG PERPENDICULAR WHITE MICROELECTRONICS CERAMIC, HIP-66 unknown 3A991.B.1.B.1 8542.32.00.51
WE128K32P300H1IA
Microsemi Corporation
Check for Price Transferred 4.1943 Mbit 32 128KX32 5 V 300 ns EEPROM MODULE ALSO CONFIGURABLE AS 512K X 8 16 1 128000 131.072 k SYNCHRONOUS PARALLEL 5 V 5.5 V 4.5 V CMOS INDUSTRIAL 10 ms S-CPGA-P66 Not Qualified 85 °C -40 °C 66 CERAMIC, METAL-SEALED COFIRED PGA SQUARE GRID ARRAY NO PIN/PEG 2.54 mm PERPENDICULAR 4.6 mm 27.3 mm 27.3 mm MICROSEMI CORP PGA, unknown 3A991.B.1.B.1 8542.32.00.51 PGA 66