Findchips: Parametric Search Results for WEDF1M32B-HM5

Parametric results for: WEDF1M32B-HM5 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		WEDF1M32B-120HM5A White Microelectronics
		WEDF1M32B-70H1I5A Mercury Systems Inc
		WEDF1M32B-90G2UI5A White Electronic Designs Corp
		WEDF1M32B-70G2TI5A Mercury Systems Inc
		WEDF1M32B-70G2TI5A Microsemi Corporation
		WEDF1M32B-90HM5A Microsemi Corporation
		WEDF1M32B-120G2UI5A White Electronic Designs Corp
		WEDF1M32B-70HM5A White Microelectronics
		WEDF1M32B-120HI5 White Electronic Designs Corp
		WEDF1M32B-70HC5 Microsemi Corporation

				Most Relevant						Technical																				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Data Retention Time-Min	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CHIP-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

CERAMIC, HIP-66

unknown

Check for Price

Active

33.5544 Mbit

16K,8K,32K,64K

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4MX8

BOTTOM

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

20 µA

200 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CPGA-P66

85 °C

-40 °C

CERAMIC

PGA

PGA66,11X11

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MERCURY SYSTEMS INC

PGA, PGA66,11X11

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

90 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CQFP-G68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

TIN LEAD

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

WHITE ELECTRONIC DESIGNS CORP

0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-G68

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

MERCURY SYSTEMS INC

QFP,

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-G68

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

MICROSEMI CORP

QFP,

compliant

EAR99

8542.32.00.51

QFP

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

90 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CPGA-P66

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

MICROSEMI CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.51

PGA

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CQFP-G68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

TIN LEAD

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

WHITE ELECTRONIC DESIGNS CORP

0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CHIP-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

CERAMIC, HIP-66

unknown

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

WHITE ELECTRONIC DESIGNS CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

COMMERCIAL

NOR TYPE

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

MICROSEMI CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

EAR99

8542.32.00.51

PGA

1 2 3 4 5 Next

Compare

WEDF1M32B-120HM5A

White Microelectronics

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CHIP-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

CERAMIC, HIP-66

unknown

WEDF1M32B-70H1I5A

Mercury Systems Inc

Check for Price

Active

33.5544 Mbit

16K,8K,32K,64K

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4MX8

BOTTOM

1,2,1,15

1000000

1.0486 M

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

20 µA

200 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CPGA-P66

85 °C

-40 °C

CERAMIC

PGA

PGA66,11X11

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

4.6 mm

27.3 mm

MERCURY SYSTEMS INC

PGA, PGA66,11X11

compliant

EAR99

8542.32.00.51

WEDF1M32B-90G2UI5A

White Electronic Designs Corp

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

90 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CQFP-G68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

TIN LEAD

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

WHITE ELECTRONIC DESIGNS CORP

0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68

unknown

EAR99

8542.32.00.51

WEDF1M32B-70G2TI5A

Mercury Systems Inc

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-G68

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

MERCURY SYSTEMS INC

QFP,

compliant

EAR99

8542.32.00.51

WEDF1M32B-70G2TI5A

Microsemi Corporation

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-G68

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

MICROSEMI CORP

QFP,

compliant

EAR99

8542.32.00.51

QFP

WEDF1M32B-90HM5A

Microsemi Corporation

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

90 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CPGA-P66

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

MICROSEMI CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.51

PGA

WEDF1M32B-120G2UI5A

White Electronic Designs Corp

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CQFP-G68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFP

SQUARE

FLATPACK

YES

TIN LEAD

GULL WING

1.27 mm

QUAD

4.57 mm

22.36 mm

WHITE ELECTRONIC DESIGNS CORP

0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68

unknown

EAR99

8542.32.00.51

WEDF1M32B-70HM5A

White Microelectronics

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

NOR TYPE

S-CHIP-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

SQUARE

IN-LINE

PIN/PEG

HEX

WHITE MICROELECTRONICS

CERAMIC, HIP-66

unknown

WEDF1M32B-120HI5

White Electronic Designs Corp

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

120 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

INDUSTRIAL

NOR TYPE

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

WHITE ELECTRONIC DESIGNS CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

EAR99

8542.32.00.51

WEDF1M32B-70HC5

Microsemi Corporation

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

70 ns

FLASH MODULE

USER CONFIGURABLE AS 4M X 8

BOTTOM

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

COMMERCIAL

NOR TYPE

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

6.22 mm

30.1 mm

MICROSEMI CORP

1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

EAR99

8542.32.00.51

PGA

1 2 3 4 5 Next