Parametric results for: WS57C128FB-45DMB under EPROMs
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WS57C128FB-45DMB
Waferscale Integration Inc
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Check for Price | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 45 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 500 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WAFERSCALE INTEGRATION INC | CERDIP-28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||
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WS57C128FB-45DMB
Teledyne e2v
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Check for Price | Active | 131.072 kbit | 8 | 16KX8 | 5 V | 45 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 40 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | TELEDYNE E2V (UK) LTD | 0.600 INCH, CERAMIC, DIP-28 | compliant | 3A001.A.2.C | 8542.32.00.61 | DIP | 28 | ||||||||||||||
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WS57C128FB-45DMB
STMicroelectronics
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 45 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 500 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | STMICROELECTRONICS | 0.600 INCH, CERDIP-28 | not_compliant | 3A001.A.2.C | 8542.32.00.61 | DIP | 28 |