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Parametric results for: XC1701/L under EEPROMs

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Manufacturer Part Number: xc1701l
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XC1701L-PD8C
 Rochester Electronics LLC 		Check for Price Yes No Active 1.0486 Mbit 1 1MX1 3.3 V CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 1000000 1.0486 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 COMMERCIAL e0 1 70 °C 225 30 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm ROCHESTER ELECTRONICS LLC DIP PLASTIC, DIP-8 8 unknown
XC1701LPCG20C
 AMD Xilinx 		Check for Price Yes Yes Obsolete 1.0486 Mbit 1 1MX1 3.3 V 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE SERIAL 50 µA 10 µA 3.6 V 3 V CMOS COMMERCIAL S-PQCC-J20 Not Qualified e3 3 70 °C 245 30 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 4.572 mm 8.9662 mm 8.9662 mm XILINX INC QLCC LEAD FREE, PLASTIC, LCC-20 20 compliant
XC1701LPCG20I
 Rochester Electronics LLC 		Check for Price No Yes Active 1.0486 Mbit 1 1MX1 3.3 V CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 1000000 1.0486 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL S-PQCC-J20 COMMERCIAL e3 3 85 °C -40 °C 245 30 20 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 4.572 mm 8.9662 mm 8.9662 mm ROCHESTER ELECTRONICS LLC QLCC QCCJ, 20 unknown
XC1701LSOG20C
 AMD Xilinx 		Check for Price Yes Obsolete 1.0486 Mbit 1 1MX1 3.3 V CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 1000000 1.0486 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G20 Not Qualified e3 3 70 °C 260 30 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.6416 mm 12.827 mm 7.5184 mm XILINX INC SOIC SOP, 20 compliant EAR99 8542.32.00.51
XC1701L-SO20C
 Rochester Electronics LLC 		Check for Price Yes No Active 1.0486 Mbit 1 1MX1 3.3 V CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 1000000 1.0486 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G20 COMMERCIAL e0 3 70 °C 225 30 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.6416 mm 12.827 mm 7.5184 mm ROCHESTER ELECTRONICS LLC SOIC PLASTIC, SOIC-20 20 unknown
XC1701LPDG8C
 AMD Xilinx 		Check for Price Yes Yes Obsolete 1.0486 Mbit 1 1MX1 3.3 V 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE SERIAL 50 µA 10 µA 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e3 1 70 °C 250 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP LEAD FREE, PLASTIC, DIP-8 8 compliant
XC1701LPD8C
 AMD Xilinx 		Check for Price No No Obsolete 1.0486 Mbit 1 1MX1 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE SERIAL 50 µA 10 µA 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e0 1 70 °C 225 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn85Pb15) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP DIP, DIP8,.3 8 not_compliant EAR99 8542.32.00.51
XC1701LPCG20I
 AMD Xilinx 		Check for Price Yes Yes Obsolete 1.0486 Mbit 1 1MX1 3.3 V 15 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE SERIAL 50 µA 10 µA 3.6 V 3 V CMOS INDUSTRIAL S-PQCC-J20 Not Qualified e3 3 85 °C -40 °C 245 30 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 4.572 mm 8.9662 mm 8.9662 mm XILINX INC QLCC LEAD FREE, PLASTIC, LCC-20 20 unknown EAR99 8542.32.00.51
XC1701L-SOG20C
 AMD Xilinx 		Check for Price Yes Obsolete 1.0486 Mbit 1 1MX1 3.3 V 60 ns CONFIGURATION MEMORY 1 1000000 1.0486 M SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G20 Not Qualified e3 3 70 °C 260 40 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 12.8 mm 7.5 mm XILINX INC SOIC PLASTIC, SOIC-20 20 compliant
XC1701LPD8I
 Rochester Electronics LLC 		Check for Price No No Active 1.0486 Mbit 1 1MX1 3.3 V CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 1000000 1.0486 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDIP-T8 COMMERCIAL e0 1 85 °C -40 °C 225 30 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm ROCHESTER ELECTRONICS LLC DIP DIP, 8 unknown
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