Findchips: Parametric Search Results for XC1701PD8C


Select Parts		Part Number

		XC1701PD8C AMD Xilinx
		XC1701-PD8C AMD Xilinx
		XC1701PD8C Rochester Electronics LLC

				Most Relevant					Technical															Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

1.0486 Mbit

1MX1

5 V

15 MHz

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

20 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.51

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Obsolete

1.0486 Mbit

1MX1

5 V

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

1000000

1.0486 M

SYNCHRONOUS

SERIAL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

compliant

Check for Price

Active

1.0486 Mbit

1MX1

5 V

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

1000000

1.0486 M

SYNCHRONOUS

SERIAL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

COMMERCIAL

70 °C

225

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

ROCHESTER ELECTRONICS LLC

DIP

DIP,

unknown

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XC1701PD8C

AMD Xilinx

Check for Price

Obsolete

1.0486 Mbit

1MX1

5 V

15 MHz

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

20 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.51

XC1701-PD8C

AMD Xilinx

Check for Price

Obsolete

1.0486 Mbit

1MX1

5 V

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

1000000

1.0486 M

SYNCHRONOUS

SERIAL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

compliant

XC1701PD8C

Rochester Electronics LLC

Check for Price

Active

1.0486 Mbit

1MX1

5 V

CONFIGURATION MEMORY

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

1000000

1.0486 M

SYNCHRONOUS

SERIAL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDIP-T8

COMMERCIAL

70 °C

225

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

ROCHESTER ELECTRONICS LLC

DIP

DIP,

unknown

Parametric results for: XC1701PD8C under EEPROMs