Parametric results for: XC1765D%20Series under EEPROMs

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Manufacturer Part Number: xc1765d
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XC1765D-PD8I
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e0 1 85 °C -40 °C 225 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn85Pb15) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP DIP, DIP8,.3 8 compliant
XC1765D-PC20C
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.25 V 4.75 V CMOS COMMERCIAL S-PQCC-J20 Not Qualified e0 3 70 °C 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 4.57 mm 8.9662 mm 8.9662 mm XILINX INC QLCC PLASTIC, LCC-20 20 compliant
XC1765D-PC20I
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQCC-J20 Not Qualified e0 3 85 °C -40 °C 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 4.57 mm 8.9662 mm 8.9662 mm XILINX INC QLCC QCCJ, LDCC20,.4SQ 20 compliant
XC1765D-PD8C
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.25 V 4.75 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e0 1 70 °C 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn85Pb15) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP DIP, DIP8,.3 8 compliant
XC1765D-VO8C
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 500 µA 10 µA 5.25 V 4.75 V CMOS COMMERCIAL R-PDSO-G8 Not Qualified e0 3 70 °C 8 PLASTIC/EPOXY TSOP TSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 1.27 mm DUAL 1.2 mm 4.9 mm 3.9 mm XILINX INC TSOP PLASTIC, TSOP-8 8 compliant
XC1765D-DD8M
AMD Xilinx
Check for Price No No Obsolete 65.536 kbit 1 64KX1 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T8 Not Qualified e0 125 °C -55 °C 8 CERAMIC, GLASS-SEALED DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.318 mm 9.906 mm 7.62 mm XILINX INC DIP CERAMIC, DIP-8 8 unknown 3A001.A.2.C 8542.32.00.51
XC1765D-DD8B
AMD Xilinx
Check for Price No No Obsolete 65.536 kbit 1 64KX1 5 V 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T8 Not Qualified e0 1 125 °C -55 °C 225 38535Q/M;38534H;883B NOT SPECIFIED 8 CERAMIC, GLASS-SEALED DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.318 mm 9.906 mm 7.62 mm XILINX INC DIP DIP, DIP8,.3 8 compliant
XC1765-DD8R
AMD Xilinx
Check for Price Obsolete 65.536 kbit 1 64KX1 5 V CONFIGURATION MEMORY 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T8 Not Qualified 125 °C -55 °C 8 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.08 mm 9.906 mm 7.62 mm XILINX INC DIP DIP, 8 unknown 3A001.A.2.C 8542.32.00.51
XC1765D-DD8R
AMD Xilinx
Check for Price No No Obsolete 65.536 kbit 1 64KX1 5 V 5 MHz CONFIGURATION MEMORY USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T8 Not Qualified e0 1 125 °C -55 °C 38535Q/M;38534H;883B 8 CERAMIC, GLASS-SEALED DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.318 mm 9.906 mm 7.62 mm XILINX INC DIP CERDIP-8 8 unknown 3A001.A.2.C 8542.32.00.51
XC1765DSO8C
AMD Xilinx
Check for Price No Obsolete 65.536 kbit 1 64KX1 5 V 5 MHz CONFIGURATION MEMORY COMMON 1 64000 65.536 k SYNCHRONOUS 3-STATE SERIAL 1.5 mA 10 µA 5.25 V 4.75 V CMOS COMMERCIAL R-PDSO-G8 Not Qualified e0 3 70 °C 225 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm XILINX INC SOIC PLASTIC, SOIC-8 8 not_compliant EAR99 8542.32.00.51