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AD9430BSVZ-170
Analog Devices Inc
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$75.2656 | No | Yes | Active | 3.3 V | 2.9 V | 1 | 0.0549 % | 12 | 170 MHz | 5.8 ns | YES | ADC, PROPRIETARY METHOD | 2.65 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | HTFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 14 mm | 1.2 mm | 14 mm | ANALOG DEVICES INC | QFP | ROHS COMPLIANT, PLASTIC, MS-026-AED, TQFP-100 | 100 | SV-100-1 | compliant | 3A991.C.2 | 8542.39.00.01 | Analog Devices | ||
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AD9430BSVZ-170
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 3.3 V | 2.9 V | 1 | 0.0549 % | 12 | 170 MHz | 5.8 ns | YES | ADC, PROPRIETARY METHOD | 2.65 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G100 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 100 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 1.2 mm | 14 mm | ROCHESTER ELECTRONICS INC | QFP | HTFQFP, | 100 | unknown |