Parametric results for: adc0808 under Analog to Digital Converters

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Manufacturer Part Number: adc0808
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ADC0808CCVX/NOPB
Texas Instruments
$3.7270 No Obsolete 5 V 6 V 8 0.293 % 8 10 kHz 116 µs YES ADC, SUCCESSIVE APPROXIMATION 4.5 V 1 BINARY SAMPLE 3 mA 4.5 V CMOS INDUSTRIAL PARALLEL, 8 BITS S-PQCC-J28 Not Qualified e3 2A 85 °C -40 °C 245 NOT SPECIFIED 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER Matte Tin (Sn) J BEND 1.27 mm QUAD 11.505 mm 4.57 mm 11.505 mm TEXAS INSTRUMENTS INC QLCC GREEN, PLASTIC, LCC-28 28 compliant EAR99 8542.39.00.01 Texas Instruments
ADC0808CCV/NOPB
Texas Instruments
$4.3748 No Obsolete 5 V 6 V 8 0.293 % 8 10 kHz 116 µs YES ADC, SUCCESSIVE APPROXIMATION 4.5 V 1 BINARY SAMPLE 3 mA 4.5 V CMOS INDUSTRIAL PARALLEL, 8 BITS S-PQCC-J28 Not Qualified e3 2A 85 °C -40 °C 245 NOT SPECIFIED 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER Matte Tin (Sn) J BEND 1.27 mm QUAD 11.505 mm 4.57 mm 11.505 mm TEXAS INSTRUMENTS INC QLCC GREEN, PLASTIC, LCC-28 28 compliant EAR99 8542.39.00.01 Texas Instruments
ADC0808CJ/883B
Texas Instruments
Check for Price No Obsolete 5 V 8 8 NO D/A CONVERTER BINARY CMOS MILITARY R-XDIP-T28 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP DIP, DIP28,.6 unknown 3A001.A.2.C 8542.39.00.01
ADC0808CJ
National Semiconductor Corporation
Check for Price No Obsolete 5 V 5.1 V 8 0.293 % 8 10 kHz 116 µs NO ADC, SUCCESSIVE APPROXIMATION -100 mV 1 BINARY CMOS MILITARY PARALLEL, 8 BITS R-GDIP-T28 Not Qualified e0 125 °C -55 °C 28 CERAMIC, GLASS-SEALED DIP DIP28,.6 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 15.24 mm 5.715 mm NATIONAL SEMICONDUCTOR CORP DIP, DIP28,.6 unknown 3A001.A.2.C 8542.39.00.01
ADC0808CCN
National Semiconductor Corporation
Check for Price No Transferred 5 V 6.1 V 8 1.1719 % 8 10 kHz 116 µs NO ADC, SUCCESSIVE APPROXIMATION -100 mV 1 BINARY SAMPLE CMOS INDUSTRIAL PARALLEL, 8 BITS R-PDIP-T28 Not Qualified e0 1 85 °C -40 °C 260 40 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 15.24 mm 5.334 mm 36.83 mm NATIONAL SEMICONDUCTOR CORP PLASTIC, DIP-28 not_compliant EAR99 8542.39.00.01
ADC0808MDC
National Semiconductor Corporation
Check for Price Yes Obsolete 5 V 5.1 V 8 0.293 % 8 116 µs YES ADC, SUCCESSIVE APPROXIMATION -100 mV 1 BINARY CMOS INDUSTRIAL PARALLEL, 8 BITS X-XUUC-N Not Qualified 1 85 °C -40 °C 260 40 UNSPECIFIED DIE DIE OR CHIP UNSPECIFIED UNCASED CHIP NO LEAD UPPER NATIONAL SEMICONDUCTOR CORP DIE, DIE OR CHIP compliant 8542.39.00.01
ADC0808CCVX/NOPB
National Semiconductor Corporation
Check for Price Yes Transferred 5 V 5.1 V 8 0.293 % 8 10 kHz 116 µs YES ADC, SUCCESSIVE APPROXIMATION -100 mV 1 BINARY CMOS INDUSTRIAL PARALLEL, 8 BITS S-PQCC-J28 Not Qualified e3 2A 85 °C -40 °C 245 30 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER Matte Tin (Sn) J BEND 1.27 mm QUAD 11.43 mm 4.57 mm 11.43 mm NATIONAL SEMICONDUCTOR CORP PLASTIC, LCC-28 compliant EAR99 8542.39.00.01
ADC0808S125HW/C1:5
NXP Semiconductors
Check for Price Obsolete 3.3 V 1 V 1 8 250 MHz YES ADC, RESISTANCE LADDER 700 mV 1 BINARY, 2'S COMPLEMENT BINARY TRACK INDUSTRIAL PARALLEL, 8 BITS S-PQFP-G49 Not Qualified 85 °C -40 °C 49 PLASTIC/EPOXY HTFQFP QFP48,.35SQ,20 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH GULL WING 500 µm QUAD 7 mm 1.2 mm 7 mm NXP SEMICONDUCTORS 7 X 7 MM, 1MM HEIGHT, SOT545-2, MS-026, PLASTIC, HTQFP-48 unknown
ADC0808S125-DB
Renesas Electronics Corporation
Check for Price No Obsolete ADC, RESISTANCE LADDER OFFSET BINARY RENESAS ELECTRONICS CORP BOARD 0 unknown 8542.39.00.01 Renesas Electronics BD0
ADC0808MDC
Texas Instruments
Check for Price Yes Obsolete 5 V 5.1 V 8 0.293 % 8 116 µs YES ADC, SUCCESSIVE APPROXIMATION -100 mV 1 BINARY CMOS INDUSTRIAL PARALLEL, 8 BITS X-XUUC-N Not Qualified 1 85 °C -40 °C 260 40 UNSPECIFIED DIE DIE OR CHIP UNSPECIFIED UNCASED CHIP NO LEAD UPPER NATIONAL SEMICONDUCTOR CORP DIE, DIE OR CHIP compliant 8542.39.00.01