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ADC1415S080HN-C18
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -2 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | INDUSTRIAL | SERIAL, PARALLEL, WORD | S-PQCC-N40 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | HVQFN-40 | 40 | NLG40 | compliant | 3A991.C.3 | 8542.39.00.01 | |||||
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ADC1415S065HN/C1
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N40 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | HVQCCN, | 40 | compliant | 3A991.C.3 | 8542.39.00.01 | ||||||
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ADC1415S125HN/C1,5
NXP Semiconductors
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Check for Price | Yes | Obsolete | 2 V | 1 | 0.03 % | 14 | YES | A/D CONVERTER | 1 | OFFSET BINARY | INDUSTRIAL | S-PQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | QCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | unknown | |||||||||||||||||||||
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ADC1415S080HN/C1
NXP Semiconductors
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Check for Price | Yes | Transferred | 3 V | 2 V | 1 | 0.0305 % | 14 | 80 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N40 | Not Qualified | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, LCC40,.24SQ,20 | 40 | unknown | 3A991.C.3 | 8542.39.00.01 | |||||||||||
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ADC1415S065HN/C1
NXP Semiconductors
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Check for Price | Yes | Transferred | 3 V | 2 V | 1 | 0.0305 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N40 | Not Qualified | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, LCC40,.24SQ,20 | 40 | unknown | 3A991.C.3 | 8542.39.00.01 | |||||||||||
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ADC1415S080HN/C1
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 80 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N40 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | HVQCCN, | 40 | compliant | 3A991.C.3 | 8542.39.00.01 | ||||||
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ADC1415S125HN-C1
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N40 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | 6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT618-6, HVQFN-40 | 40 | NLG40 | compliant | 8542.39.00.01 | ||||||
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ADC1415S080HN-C1
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 2 V | 0.03 % | 14 | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY | 3,5 V | CMOS | INDUSTRIAL | S-PQCC-N40 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 40 | PLASTIC/EPOXY | QCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | 6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT618-6, HVQFN-40 | 40 | NLG40 | compliant | |||||||||||||
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ADC1415S125HN/C1,5
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 2 V | 1 | 0.03 % | 14 | YES | A/D CONVERTER | 1 | OFFSET BINARY | INDUSTRIAL | S-PQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | QCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QCCN, LCC40,.24SQ,20 | compliant | 3A991.C.3 | 8542.39.00.01 | |||||||||||||||||
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ADC1415S125HN-C18
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 125 MHz | YES | ADC, PROPRIETARY METHOD | -2 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | INDUSTRIAL | SERIAL, PARALLEL, WORD | S-PQCC-N40 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | PLASTIC/EPOXY | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN | NO LEAD | 500 µm | QUAD | 6 mm | 1 mm | 6 mm | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | HVQFN-40 | 40 | NLG40 | compliant | 3A991.C.3 | 8542.39.00.01 |