Parametric results for: am27s37 under OTP ROMs
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AM27S37LMB
AMD
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 200 ns | OTP ROM | 1 | 128000 | 1.024 k | ASYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 4.5 V | TTL | MILITARY | R-XQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | ADVANCED MICRO DEVICES INC | QCCN, LCC32,.45X.55 | unknown | EAR99 | 8542.32.00.71 | |||||||||
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AM27S37DC
AMD
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | OTP ROM | 1 | 8000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | COMMERCIAL EXTENDED | R-GDIP-T24 | Not Qualified | e0 | 75 °C | 24 | CERAMIC, GLASS-SEALED | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 31.9405 mm | 7.62 mm | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | DIP | 24 | ||||
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AM27S37PCB
AMD
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Check for Price | No | Obsolete | 2.048 kbit | 4 | 512X4 | 5 V | 60 ns | OTP ROM | 1 | 512 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | COMMERCIAL EXTENDED | R-PDIP-T24 | Not Qualified | e0 | 75 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.715 mm | 31.242 mm | 7.62 mm | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | DIP | 24 | |||||
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AM27S37/BLA
AMD
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Check for Price | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 90 ns | OTP ROM | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | MILITARY | R-GDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC, GLASS-SEALED | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 31.9405 mm | 7.62 mm | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | DIP | 24 | |||
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AM27S37DCT
AMD
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 90 ns | OTP ROM | 1 | 32000 | 1.024 k | ASYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 4.5 V | TTL | COMMERCIAL | R-XDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | |||||||||||
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AM27S37AJCB
AMD
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Check for Price | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 20 ns | OTP ROM | 1 | 1000 | 1.024 k | SYNCHRONOUS | 3-STATE | PARALLEL | 5.25 V | 4.75 V | BIPOLAR | COMMERCIAL EXTENDED | S-PQCC-J28 | Not Qualified | 75 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.57 mm | 11.5062 mm | 11.5062 mm | ADVANCED MICRO DEVICES INC | QCCJ, | unknown | EAR99 | 8542.32.00.71 | QLCC | 28 | ||||||||||
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AM27S37APCT
AMD
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 90 ns | OTP ROM | 1 | 32000 | 1.024 k | ASYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 4.5 V | TTL | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | |||||||||||
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AM27S37ALC
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | OTP ROM | 1 | 8000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | COMMERCIAL EXTENDED | R-CQCC-N32 | Not Qualified | e0 | 75 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QCCN, LCC32,.45X.55 | unknown | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||
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AM27S37ADCTB
AMD
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 3.3 V | 200 ns | OTP ROM | 1 | 1000000 | 1.024 k | ASYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 3 V | TTL | COMMERCIAL | R-XDIP-T24 | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | ||||||||||||
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AM27S37A/B3C
AMD
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Check for Price | No | No | Obsolete | 524.288 kbit | 8 | 64KX8 | 5 V | 200 ns | OTP ROM | 1 | 64000 | 1.024 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.25 V | 4.75 V | BIPOLAR | MILITARY | S-CQCC-N28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1.905 mm | 11.43 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QCCN, LCC28,.45SQ | unknown | EAR99 | 8542.32.00.71 | QLCC | 28 |