Findchips: Parametric Search Results for am29dl32

Parametric results for: am29dl32 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29DL320GT90WMI Spansion
		AM29DL320GB120EIN AMD
		AM29DL323GB70WMIN AMD
		AM29DL322GB120PCF AMD
		AM29DL323GB70WMI AMD
		AM29DL322GB90FF Spansion
		AM29DL324GT70RWDFN Spansion
		AM29DL322DT70WDI AMD
		AM29DL323DT90WDIN AMD
		AM29DL324GB90EEN AMD

			Most Relevant						Technical																								Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Data Retention Time-Min	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

90 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0,80 MM PITCH, FBGA-63

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

HARDWARE DATA PROTECTION/RESET PIN, 1 MI... more

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142DD, TSOP-48

unknown

3A001.A.2.C

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29DL320GT90WMI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

AM29DL320GB120EIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP

TSOP1, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

AM29DL323GB70WMIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

AM29DL322GB120PCF

AMD

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

120 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

AM29DL323GB70WMI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA48,6X8,32

unknown

EAR99

8542.32.00.51

AM29DL322GB90FF

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

90 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

EAR99

8542.32.00.51

AM29DL324GT70RWDFN

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

SPANSION INC

BGA

8 X 14 MM, 0,80 MM PITCH, FBGA-63

compliant

EAR99

8542.32.00.51

AM29DL322DT70WDI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

HARDWARE DATA PROTECTION/RESET PIN, 1 MI... more

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL323DT90WDIN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

TFBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

AM29DL324GB90EEN

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

90 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142DD, TSOP-48

unknown

3A001.A.2.C

8542.32.00.51

1 2 3 4 5 Next