Findchips: Parametric Search Results for am29dl800bb70

Parametric results for: am29dl800bb70 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29DL800BB70SI Spansion
		AM29DL800BB70RFD Spansion
		AM29DL800BB70RWBI Spansion
		AM29DL800BB70RWBD Spansion
		AM29DL800BB70WBD AMD
		AM29DL800BB70RSF Spansion
		AM29DL800BB70WBI AMD
		AM29DL800BB70FC Spansion
		AM29DL800BB70EF Spansion
		AM29DL800BB70RWBC AMD

				Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Ready/Busy	Reverse Pinout	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

SOIC

MO-180AAA, SOP-44

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PDSO-G48

Not Qualified

70 °C

PLASTIC/EPOXY

TSOP2-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

PARALLEL

YES

5 µA

45 µA

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

MATTE TIN

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

SOIC

SOP-44

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLES; CAN ALSO BE CONFIGURED AS 512K X 16

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

REVERSE, MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

LEAD FREE, MO-142BDD, TSOP-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29DL800BB70SI

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

SOIC

MO-180AAA, SOP-44

compliant

EAR99

8542.32.00.51

AM29DL800BB70RFD

Spansion

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PDSO-G48

Not Qualified

70 °C

PLASTIC/EPOXY

TSOP2-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

EAR99

8542.32.00.51

AM29DL800BB70RWBI

Spansion

Check for Price

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

AM29DL800BB70RWBD

Spansion

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

SPANSION INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

compliant

EAR99

8542.32.00.51

AM29DL800BB70WBD

AMD

Check for Price

Yes

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

PARALLEL

YES

5 µA

45 µA

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

AM29DL800BB70RSF

Spansion

Check for Price

Yes

Obsolete

8.3886 Mbit

512KX16

3.3 V

70 ns

FLASH

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

MATTE TIN

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

SOIC

SOP-44

compliant

EAR99

8542.32.00.51

AM29DL800BB70WBI

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

MINIMUM 1000K PROGRAM/ERASE CYCLES; CAN ALSO BE CONFIGURED AS 512K X 16

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29DL800BB70FC

Spansion

Check for Price

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

REVERSE, MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

AM29DL800BB70EF

Spansion

Check for Price

Yes

Obsolete

8.3886 Mbit

16K,8K,32K,64K

512KX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

LEAD FREE, MO-142BDD, TSOP-48

unknown

EAR99

8542.32.00.51

AM29DL800BB70RWBC

AMD

Check for Price

Transferred

8.3886 Mbit

16K,8K,32K,64K

512KX16

3.3 V

70 ns

FLASH

BOTTOM

YES

2,4,2,14

512000

524.288 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

3 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

6 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 9 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next