Parametric results for: applications under SRAMs

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Memory IC Type: APPLICATION SPECIFIC SRAM
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IS66WV51216DBLL-70TLI-TR
Integrated Silicon Solution Inc
$2.2005 Yes Yes Obsolete 8.3886 Mbit 16 512KX16 3 V 70 ns APPLICATION SPECIFIC SRAM COMMON 1 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 130 µA 28 µA 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41
IS61WV25616EDBLL-10BLI
Integrated Silicon Solution Inc
$2.5692 Yes Yes Active 16.7772 Mbit 16 1MX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 1000000 1.0486 M ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 35 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV12816DBLL-10TLI-TR
Integrated Silicon Solution Inc
$2.6158 Yes Yes Active 2.0972 Mbit 16 128KX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 70 µA 2 V 65 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.415 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS66WV51216DBLL-55TLI-TR
Integrated Silicon Solution Inc
$2.6406 Yes Yes Obsolete 8.3886 Mbit 16 512KX16 3 V 55 ns APPLICATION SPECIFIC SRAM COMMON 1 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 130 µA 28 µA 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41
IS61WV25616EDBLL-10BLI-TR
Integrated Silicon Solution Inc
$3.5400 Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 35 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8TLI
Integrated Silicon Solution Inc
$4.1845 Yes Yes Active 4.1943 Mbit 16 256KX16 3.3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8TLI-TR
Integrated Silicon Solution Inc
$4.1852 Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8BLI
Integrated Silicon Solution Inc
$5.4654 Yes Yes Active 4.1943 Mbit 16 256KX16 3.3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
71V2556SA100BGGI8
Integrated Device Technology Inc
$6.7756 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz APPLICATION SPECIFIC SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 compliant 3A991.B.2.A 8542.32.00.41 PBGA 119 BGG119 1998-08-01
7009L20PFG8
Integrated Device Technology Inc
$46.0656 Yes Yes Transferred 1.0486 Mbit 8 128KX8 5 V 20 ns APPLICATION SPECIFIC SRAM COMMON 1 2 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 3 mA 4.5 V 300 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY QFP QFP100,.63SQ,20 SQUARE FLATPACK YES MATTE TIN GULL WING 500 µm QUAD INTEGRATED DEVICE TECHNOLOGY INC TQFP-100 compliant 3A991.B.2.A 8542.32.00.41 TQFP 100 PNG100