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IS66WV51216DBLL-70TLI-TR
Integrated Silicon Solution Inc
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$2.2005 | Yes | Yes | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3 V | 70 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 130 µA | 28 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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IS61WV25616EDBLL-10BLI
Integrated Silicon Solution Inc
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$2.5692 | Yes | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 35 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV12816DBLL-10TLI-TR
Integrated Silicon Solution Inc
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$2.6158 | Yes | Yes | Active | 2.0972 Mbit | 16 | 128KX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 70 µA | 2 V | 65 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS66WV51216DBLL-55TLI-TR
Integrated Silicon Solution Inc
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$2.6406 | Yes | Yes | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3 V | 55 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 130 µA | 28 µA | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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IS61WV25616EDBLL-10BLI-TR
Integrated Silicon Solution Inc
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$3.5400 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3 V | 10 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 35 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8TLI
Integrated Silicon Solution Inc
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$4.1845 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.63 V | 2.97 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8TLI-TR
Integrated Silicon Solution Inc
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$4.1852 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP44,.46,32 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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IS61WV25616EDBLL-8BLI
Integrated Silicon Solution Inc
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$5.4654 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 8 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 6 mA | 2 V | 45 µA | 3.63 V | 2.97 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA48,6X8,30 | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
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71V2556SA100BGGI8
Integrated Device Technology Inc
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$6.7756 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 100 MHz | APPLICATION SPECIFIC SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 260 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.36 mm | 22 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 | compliant | 3A991.B.2.A | 8542.32.00.41 | PBGA | 119 | BGG119 | 1998-08-01 | ||||
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7009L20PFG8
Integrated Device Technology Inc
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$46.0656 | Yes | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 20 ns | APPLICATION SPECIFIC SRAM | COMMON | 1 | 2 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFP | QFP100,.63SQ,20 | SQUARE | FLATPACK | YES | MATTE TIN | GULL WING | 500 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PNG100 |