Parametric results for: at28hc256f under EEPROMs

All Filters Access Time-Max Additional Feature Command User Interface Data Polling Data Retention Time-Min Endurance JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Ports Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Supply Voltage-Nom (Vsup) Access Time-Max (3)

70 ns 25 90 ns 49 120 ns 54

Min (ns) - Max (ns)

128 hits Apply

AUTOMATIC WRITE 96 AUTOMATIC WRITE; PAGE WRITE 2 HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION = 10 YEARS 10

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NO 77

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YES 77

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10 18

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10000.0 Write/Erase Cycles 69

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R-CDFP-F28 10 R-CPGA-P28 14 R-CQCC-N32 16 R-GDIP-T28 14 R-PDIP-T28 13 R-PDSO-G28 31 R-PQCC-J32 30

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e0 77 e3 43

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11.8 mm 16 13.97 mm 46 16.5 mm 12 16.51 mm 2 17.9 mm 15 18.285 mm 2 18.3 mm 8 37.0205 mm 13 37.215 mm 2 37.25 mm 12

Min (mm) - Max (mm)

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Manufacturer (2)

Atmel Corporation 114 Microchip Technology Inc 14

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Memory Density (1)

262.144 kbit 128

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EEPROM 128

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Memory Width (1)

8 128

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1 47 2 31 3 14

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1.0 128

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1 8

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28 82 32 46

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32.768 k 128

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32000.0 128

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ASYNCHRONOUS 128

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70.0 °C 41 85.0 °C 69 125.0 °C 18

Min (°C) - Max (°C)

128 hits Apply

-55.0 °C 18 -40.0 °C 69 0.0 °C 41

Min (°C) - Max (°C)

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Organization (1)

32KX8 128

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3-STATE 107

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CERAMIC, GLASS-SEALED 14 CERAMIC, METAL-SEALED COFIRED 40 PLASTIC/EPOXY 74

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DFP 10 DIP 27 LSSOP 1 PGA 14 QCCJ 30 QCCN 16 SOP 15 TSOP 1 TSOP1 14

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DIP28,.6 19 FL28,.4 10 LCC32,.45X.55 12 LDCC32,.5X.6 10 PGA28(UNSPEC) 7 PGA28,5X6 3 SOP28,.4 7 TSSOP28,.53,22 9

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RECTANGULAR 128

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CHIP CARRIER 46 FLATPACK 10 GRID ARRAY 14 IN-LINE 27 SMALL OUTLINE 15 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 1 SMALL OUTLINE, THIN PROFILE 15

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64 words 77

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Supply Voltage-Nom (Vsup) (1)

5 V 128

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