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AX500-2FGG676
Microsemi Corporation
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$340.0960 | Yes | Transferred | 1.5 V | 336 | 336 | 8064 | 500000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROSEMI CORP | BGA, BGA676,26X26,40 | compliant | 8542.39.00.01 | |||||||
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AX500-2FGG676I
Microsemi Corporation
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$446.4385 | Yes | Transferred | 1.5 V | 336 | 336 | 8064 | 500000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROSEMI CORP | BGA, BGA676,26X26,40 | compliant | 8542.39.00.01 | ||||||
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AX500-2FGG676
Microchip Technology Inc
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Check for Price | Yes | Active | 1.5 V | 336 | 336 | 8064 | 500000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | compliant | 8542.39.00.01 | |||||||
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AX500-2FGG676M
Microchip Technology Inc
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Check for Price | Yes | Active | 1.5 V | 500000 | 5376 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | compliant | 8542.39.00.01 | 3A001.A.2.C | |||||||||||
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AX500-2FGG676I
Actel Corporation
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Check for Price | Yes | Transferred | 1.5 V | 336 | 336 | 8064 | 286000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 5376 CLBS, 286000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | ACTEL CORP | 1 MM PITCH, FBGA-676 | compliant | |||||||||
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AX500-2FGG676M
Microsemi FPGA & SoC
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Check for Price | Transferred | 1.5 V | 500000 | 5376 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROSEMI SOC PRODUCTS GROUP | BGA, | unknown | 8542.39.00.01 | 3A001.A.2.C | BGA | 676 | ||||||||||
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AX500-2FGG676M
Microsemi Corporation
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Check for Price | Yes | Transferred | 1.5 V | 500000 | 5376 | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | MILITARY | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROSEMI CORP | BGA, | compliant | 8542.39.00.01 | 3A001.A.2.C | |||||||||||
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AX500-2FGG676I
Microchip Technology Inc
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Check for Price | Yes | Active | 1.5 V | 336 | 336 | 8064 | 500000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 5376 CLBS, 500000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | compliant | 8542.39.00.01 | ||||||
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AX500-2FGG676
Actel Corporation
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Check for Price | Yes | Transferred | 1.5 V | 336 | 336 | 8064 | 286000 | 5376 | 740 ps | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 5376 CLBS, 286000 GATES | 500000 SYSTEM GATES AVAILABLE | 870 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | ACTEL CORP | 1 MM PITCH, FBGA-676 | compliant |