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CGA4J1X7R1E335M125AC
TDK Corporation
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$0.0767 | Yes | Yes | Active | 3.3 µF | 25 V | 20 % | 0805 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1E335K125AC
TDK Corporation
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$0.0894 | Yes | Yes | Active | 3.3 µF | 25 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1V335M125AC
TDK Corporation
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$0.0976 | Yes | Yes | Active | 3.3 µF | 35 V | 20 % | 0805 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1E475M125AC
TDK Corporation
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$0.0995 | Yes | Yes | Active | 4.7 µF | 25 V | 20 % | 0805 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1V475K125AC
TDK Corporation
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$0.1011 | Yes | Yes | Active | 4.7 µF | 35 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1V225M125AE
TDK Corporation
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$0.1017 | Yes | Yes | Active | 2.2 µF | 35 V | 20 % | 0805 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1V475M125AC
TDK Corporation
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$0.1067 | Yes | Yes | Active | 4.7 µF | 35 V | 20 % | 0805 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1V155K125AC
TDK Corporation
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$0.1166 | Yes | Yes | Active | 1.5 µF | 35 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA4J1X7R1H475K125AC
TDK Corporation
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$0.1245 | Yes | Active | 4.7 µF | 50 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA4J1X7R1V335K125AC
TDK Corporation
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$0.1401 | Yes | Yes | Active | 3.3 µF | 35 V | 10 % | 0805 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 1.25 mm | 2 mm | 1.25 mm | TDK CORP | , 0805 | compliant | EAR99 | 8532.24.00.20 | TDK |