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CKCM25X7R1H102M066AA
TDK Corporation
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Check for Price | Yes | Yes | Active | 1 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | TR, 7 INCH | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 660 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H222M066AA
TDK Corporation
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Check for Price | Yes | Yes | Active | 2.2 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | TR, 7 INCH | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 660 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H222MT
TDK Corporation
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Check for Price | Yes | Yes | Active | 2.2 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | TR | YES | Tin (Sn) - with Nickel (Ni) barrier | 640 µm | WRAPAROUND | 1.37 mm | 900 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H472MB
TDK Corporation
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Check for Price | Yes | Yes | Active | 4.7 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | BULK | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 900 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H472M(066AA)
TDK Corporation
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Check for Price | Yes | Active | 4.7 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | TR, 7 INCH | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 660 µm | 1 mm | TDK CORP | CHIP, | unknown | EAR99 | 8532.25.00.45 | |||
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CKCM25X7R1H102M060AA
TDK Corporation
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Check for Price | Yes | Yes | Obsolete | 1 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | YES | MATTE TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 600 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||||
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CKCM25X7R1E103MB
TDK Corporation
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Check for Price | Yes | Yes | Active | 10 nF | 25 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | BULK | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 900 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H222MB
TDK Corporation
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Check for Price | Yes | Yes | Active | 2.2 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | BULK | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 900 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1E103M066AA
TDK Corporation
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Check for Price | Yes | Yes | Active | 10 nF | 25 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | TR, 7 INCH | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 660 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 | ||
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CKCM25X7R1H102MB
TDK Corporation
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Check for Price | Yes | Yes | Active | 1 nF | 50 V | 20 % | X7R | 20 % | SURFACE MOUNT | ARRAY/NETWORK CAPACITOR | CKC | ISOLATED C NETWORK | 2 | 15% ppm/°C | e3 | 125 °C | -55 °C | 1 | 4 | CHIP | RECTANGULAR PACKAGE | BULK | YES | TIN OVER NICKEL | 640 µm | WRAPAROUND | 1.37 mm | 900 µm | 1 mm | TDK CORP | CHIP, | compliant | EAR99 | 8532.25.00.45 |