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CY7C1024DV33-10BGXI
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 3.1457 Mbit | 24 | 128KX24 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 mA | 2 V | 175 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 22 X 14 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1024DV33-10BGXIT
Cypress Semiconductor
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Check for Price | Yes | Yes | Obsolete | 3.1457 Mbit | 24 | 128KX24 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 mA | 2 V | 175 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 119 | PLASTIC/EPOXY | HBGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | 22 X 14 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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CY7C1024DV33-10BGXI
Infineon Technologies AG
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Check for Price | Yes | Obsolete | 3.1457 Mbit | 24 | 128KX24 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 25 mA | 2 V | 175 µA | 3.6 V | 3 V | CMOS | R-PBGA-B119 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | INFINEON TECHNOLOGIES AG | BGA-119 | compliant |